Effect of thin-film texture and zirconium diffusion on reliability against electromigration in chemical-vapor-deposited copper interconnects

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 37, Issue 3 SUPPL. B, 1998, Pages 1156-1161

  Awaya, Nobuyoshi ^a   Kobayashi, Toshio ^a  

^a NTT CORPORATION   (Japan)

Author keywords

Chemical vapor deposition; Copper; Electromigration; Interconnection; Zirconium

Indexed keywords

EID: 0011704427     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.37.1156     Document Type: Article

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