Joint strength of aluminum ultrasonic soldered under liquidus temperature of Sn-Zn hypereutectic solder

Journal of Materials Processing Technology

Volumn 209, Issue 11, 2009, Pages 5054-5059

  Nagaoka, Toru ^a   Morisada, Yoshiaki ^a   Fukusumi, Masao ^a   Takemoto, Tadashi ^b  

^a OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE   (Japan)

^b OSAKA UNIVERSITY   (Japan)

Author keywords

1070 aluminum; Joint strength; Sn Zn solder; Tensile strength; Ultrasonic soldering

Indexed keywords

1070 ALUMINUM; ALUMINUM JOINTS; HIGH STRENGTHS; JOINT STRENGTH; LIQUID-PHASE; LIQUIDUS TEMPERATURES; SN-ZN SOLDER; SOLDER COMPOSITIONS; SOLDER JOINTS; SOLDER LAYERS; SOLDERING TEMPERATURES; TENSILE TESTS; ULTRASONIC SOLDERING; ULTRASONIC VIBRATIONS;

ALUMINA; ALUMINUM; BRAZING; JOINING; STRENGTH OF MATERIALS; TENSILE STRENGTH; TENSILE TESTING; ULTRASONICS; WELDING; ZINC;

TIN;

EID: 67349123717     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2009.02.003     Document Type: Article

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