In situ measurement of bond resistance varying with process parameters during ultrasonic wedge bonding

Journal of Materials Processing Technology

Volumn 209, Issue 1, 2009, Pages 139-144

  Ji, Hongjun ^a,b   Li, Mingyu ^a   Wang, Chunqing ^b   Bang, Han Sur ^c   Bang, Hee Seon ^c  

^a University Town of Shenzhen   (China)

^b HARBIN INSTITUTE OF TECHNOLOGY   (China)

^c Chosun University   (South Korea)

Author keywords

Bond resistance; Deformation; Interface; Ultrasonic wedge bonding

Indexed keywords

DEFORMATION; ELECTRIC PROPERTIES; ULTRASONIC MEASUREMENT; ULTRASONICS;

BOND INTERFACES; BOND RESISTANCE; BOND RESISTANCES; BOND-WIRE; DEFORMATION RESISTANCES; ELECTRICAL PROPERTIES; IN-SITU; INTERFACE; INTERFACIAL RESISTANCES; POWER CARRIERS; PROCESS PARAMETERS; SINGLE BONDS; ULTRASONIC; ULTRASONIC BONDINGS; ULTRASONIC POWERS; ULTRASONIC WEDGE BONDING; WEDGE BONDINGS;

BOND STRENGTH (CHEMICAL);

EID: 54049130117     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2008.01.036     Document Type: Article

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