Novel ultrasonic soldering technique for lead-free solders

Materials Transactions

Volumn 45, Issue 3, 2004, Pages 703-709

  Kago, Keitaro ^a   Suetsugu, Kenichiro ^b   Hibino, Shunji ^c   Ikari, Takashi ^b   Furusawa, Akio ^b   Takano, Hiroaki ^d   Horiuchi, Toshihisa ^a   Ishida, Kenji ^a   Sakaguchi, Takuma ^a   Kikuchi, Shiomi ^e   Matsushige, Kazumi ^a  

^a KYOTO UNIVERSITY   (Japan)

^b PANASONIC CORPORATION   (Japan)

^c Matsushita Solution T Co Ltd   (Japan)

^d Matsushita Techno Research Co Ltd   (Japan)

^e UNIVERSITY OF SHIGA PREFECTURE   (Japan)

Author keywords

Homogenization; Interfacial layer; Lead free solder; Reflow soldering; Tin bismuth solder; Ultrasound

Indexed keywords

BOND STRENGTH (MATERIALS); BONDING; CHARGE COUPLED DEVICES; EUTECTICS; PRINTED CIRCUIT BOARDS; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SOLDERING; TIN ALLOYS; ULTRASONICS; X RAY PHOTOELECTRON SPECTROSCOPY;

HOMOGENIZATION; INTERFACIAL LAYER; LEAD-FREE SOLDER; REFLOW SOLDERING; TIN-BISMUTH SOLDER; ULTRASOUND SOLDERING;

SOLDERING ALLOYS;

EID: 2442443048     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.45.703     Document Type: Article

References (13)

1. The Japan Electronics and Information Technology Industries Association, http://www.jeita.or.jp/english/press/2002/1217/index.htm
2. Directive 2002/95/EC of the European parliament and of the council of 27 January 2003.
3. J. Glazer: J. Electron. Mater. 23 (1994) 693-700.
4. T. A. Powers, T. J. Singler and J. A. Clum: J. Electron. Mater. 23 (1994) 773-778.
5. K. Suganuma: Scr. Materialia 38 (1998) 1333-1340.
6. K. Matsushige, K. Suetsugu, T. Ikari, T. Horiuchi, K. Kuboyama, K. Ishida and S. Kikuchi: Proc. International Summit on Lead-Free Electronics Assemblies (IPC Works '99) (IPC, 1999) pp. S-05-3.
7. K. Matsushige, T. Horiuchi, T. Ikari, K. Suetsugu, M. Hirano, S. Hibino and A. Yamaguchi: Jpn. Kokai Tokkyo Koho JP 2000351065 (2000) & European patent EP 1 195 217 Al (2000).
8. S. Kikuchi, M. Nishimura, K. Suetsugu, T. Ikari and K. Matsushige: Mat. Sci. Eng. A319-321 (2001) 475-479.
9. Y. Hori and I. Uezawa: J. Japan Inst. Metals 23 (1959) 168-172.
10. K. Suetsugu, S. Hibino, Y. Maeda, Y. Kabajima, Y. Wada, K. Matsushige, T. Horiuchi and K. Kago: Jpn. Kokai Tokkyo Koho JP 200346228 (2003).
11. A. Benatar, R. V. Eswaran and S. K. Nayar: Polym. Eng. Sci. 29 (1989) 1689-1698.
12. A. Benatar, R. V. Eswaran and S. K. Nayar: Polym. Eng. Sci. 29 (1989) 1699-1704.
13. K. Suganuma, T. Shotoku, Y. Nakamura and K. Niihara: J. Mater. Res. 13 (1998) 2859-2865.