Influence of die attach layer on thermal performance of high power light emitting diodes

IEEE Transactions on Components and Packaging Technologies

Volumn 33, Issue 4, 2010, Pages 722-727

  Yan, Bohan ^a   You, Jiun Pyng ^b,c   Tran, Nguyen T ^b,c   He, Yongzhi ^a   Shi, Frank G ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b NEPES LED   (United States)

^c Nepes Corperation   (South Korea)

Author keywords

Die attach material; finite element analysis; light emitting diodes; thermal performance

Indexed keywords

DIE ATTACH; DIE ATTACH ADHESIVE; DIE-ATTACH MATERIALS; EXPERIMENTAL DATA; FINITE ELEMENT ANALYSIS; GEOMETRY PARAMETER; HEAT DISSIPATION; HIGH POWER LIGHT EMITTING DIODES; THERMAL MANAGEMENT; THERMAL PERFORMANCE;

DIES; DIODES; LIGHT EMISSION; LIGHT EMITTING DIODES; MIXED CONVECTION; THERMAL CONDUCTIVITY; WATER ANALYSIS;

FINITE ELEMENT METHOD;

EID: 78651068889     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2009.2032097     Document Type: Article

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