Multi-chip integrated high-power white LED device on the multi-layer ceramic substrate

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 790-794

  Yin, Luqiao ^a,b   Yang, Weiqiao ^a   Guo, Yansheng ^a   Ma, Kejun ^a   Li, Shuzhi ^a   Chen, Mingfa ^a   Li, Jia ^a   Zhang, Jianhua ^a,b  

^a SHANGHAI UNIVERSITY   (China)

^b BEIJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; ALUMINUM; ALUMINUM COMPOUNDS; CARBON FIBER REINFORCED PLASTICS; CERAMIC COATINGS; CERAMIC MATERIALS; COMPUTER NETWORKS; HELIUM; LIGHT METALS; NITRIDES; SILVER; THERMAL CONDUCTIVITY; THERMAL INSULATING MATERIALS; THERMOANALYSIS; THERMODYNAMIC PROPERTIES; THERMOELECTRICITY;

MULTI LAYERING; P-N JUNCTIONS;

SUBSTRATES;

EID: 51349086077     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550064     Document Type: Conference Paper

References (4)

1. Won Kyu Jeung; Sang Hyun Shin; Suk Youn Hong; Seog Moon Choi; Sung Yi; Young Bok Yoon; Hyun Jun Kim; Sung Jun Lee; Ki Yeol Park; "Silicon-Based, Multi-Chip LED Package," Electronic Components and Technology Conference, May 29 2007-June 1 2007, Page(s):722 -727.
2. Kim, Lan; Shin, Moo Whan; "Implementation of side effects in thermal characterization of RGB full-color LEDs," IEEE Electron Device Letters, v 28, n 7 (2007), p 578-580.
3. Chingfu Tsou; Yu-Sheng Huang; "Advanced Packaging, Silicon-Based Packaging Platform for Light-Emitting Diode," IEEE Transactions on, Volume 29, Issue 3, Aug. 2006, Page(s):607-614.
4. Lan Kim; Woong Joon Hwang; Moo Whan Shin; "Thermal Resistance Analysis of High Power LEDs with Multi-chip Package," Electronic Components and Technology Conference, 2006. Proceedings. 56th 30 May-2 June 2006 Page(s):1076-1081.