One-component, low-temperature, and fast cure epoxy encapsulant with high refractive index for LED applications

IEEE Transactions on Advanced Packaging

Volumn 31, Issue 3, 2008, Pages 484-489

  Zhou, Yan ^a   Tran, Nguyen ^a   Lin, Yuan Chang ^a   He, Yongzhi ^a   Shi, Frank G ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Epoxy encapsulant; High refractive index; Light emitting diodes (LED) packaging material; One component optical encapsulant

Indexed keywords

AROMATIC STRUCTURES; CROSS-LINKED NETWORKS; CYCLOALIPHATIC EPOXY RESINS; DIGLYCIDYL ETHER OF BISPHENOL-A; EFFECT OF ADDITIONS; EPOXY ENCAPSULANT; EXPERIMENTAL MEASUREMENTS; FAST CURES; HARDNESS MEASUREMENTS; HIGH DENSITIES; HIGH REFRACTIVE INDEX; LED DEVICES; LIGHT EMITTING DIODES (LED) PACKAGING MATERIAL; LIGHT OUTPUTS; LOW TEMPERATURES; ONE-COMPONENT OPTICAL ENCAPSULANT; ROOM TEMPERATURE STABILITIES; ROOM TEMPERATURES; THERMAL INITIATORS;

AMMONIUM COMPOUNDS; ANTIMONY; CATIONIC POLYMERIZATION; CHEMICAL REACTIVITY; CROSSLINKING; CURING; DIODES; EPOXY RESINS; ETHERS; INITIATORS (CHEMICAL); LIGHT EMISSION; LIGHT REFRACTION; MONOMERS; PACKAGING MATERIALS; PHENOLS; POLYMERS; REFRACTIVE INDEX; REFRACTOMETERS; RESINS;

LIGHT EMITTING DIODES;

EID: 67349268925     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2008.924233     Document Type: Article

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