Thermal analyses and measurements of low-cost COP package for high-power LED

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1812-1819

  Tsai, M Y ^a   Chen, C H ^a   Kang, C S ^a  

^a CHANG GUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTER NETWORKS; DYNAMICS; FLUID DYNAMICS; FLUID MECHANICS; FLUORESCENT LAMPS; HEAT RESISTANCE; HEAT SINKS; LIGHT EMISSION; LIGHT EMITTING DIODES; LIGHTING; LUBRICATING GREASES; MATERIALS SCIENCE; PETROLEUM PRODUCTS; PHYSICAL OPTICS; THERMAL CONDUCTIVITY; THERMOANALYSIS;

ELECTRONIC COMPONENTS; JUNCTION TEMPERATURES;

FINITE ELEMENT METHOD;

EID: 51349161391     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550227     Document Type: Conference Paper

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