Cost-effective integration of three-dimensional (3D) ICs emphasizing testing cost analysis

IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD

Volumn , Issue , 2010, Pages 471-475

  Chen, Yibo ^a   Niu, Dimin ^a   Xie, Yuan ^a   Chakrabarty, Krishnendu ^b  

^a The Pennsylvania State University   (United States)

^b Duke University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3D MODELING; COMMERCE; COMPUTER AIDED DESIGN; COST ACCOUNTING; COST BENEFIT ANALYSIS; COST EFFECTIVENESS; COSTS; ECONOMIC AND SOCIAL EFFECTS; INTEGRATED CIRCUIT DESIGN; INTEGRATION; THREE DIMENSIONAL INTEGRATED CIRCUITS; TIMING CIRCUITS;

DESIGN APPROACHES; EMERGING TECHNOLOGIES; HETEROGENEOUS INTEGRATION; INTEGRATION METHOD; MEMORY BANDWIDTHS; TESTING CIRCUITS; TESTING STRATEGIES; THREEDIMENSIONAL (3-D);

INTEGRATION TESTING;

EID: 78650872716     PISSN: 10923152     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICCAD.2010.5653753     Document Type: Conference Paper

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