An efficient approach to SiP design integration

Proceedings of the 10th International Symposium on Quality Electronic Design, ISQED 2009

Volumn , Issue , 2009, Pages 241-247

  Chan, Meng Syue ^a   Wang, Chun Yao ^a   Chen, Yung Chih ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Optimization; System in Package (SiP)

Indexed keywords

COST CONSTRAINTS; DEFECT LEVELS; DESIGN METHODOLOGY; DEVELOPMENT COSTS; HIGH COSTS; MINIMAL COST; POWER CONSUMPTION; QUALITY CONSTRAINTS; SIP DESIGN; SOLUTION SPACE; SYSTEM-IN-PACKAGE; SYSTEM-IN-PACKAGE (SIP); SYSTEM-ON-A-CHIP DESIGNS; TEST COVERAGE; TIME-TO-MARKET;

APPLICATION SPECIFIC INTEGRATED CIRCUITS; CELLULAR RADIO SYSTEMS; CONSTRAINED OPTIMIZATION; COSTS; DESIGN; DIES; INTERNET PROTOCOLS; OPTIMIZATION; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; SYSTEMS ANALYSIS;

PRINTED CIRCUIT DESIGN;

EID: 67649644208     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISQED.2009.4810301     Document Type: Conference Paper

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