SCOPUS 정보 검색 플랫폼

Journal of the Electrochemical Society

Volumn 158, Issue 2, 2011, Pages

Ultrathin Ru-Ta-C barriers for Cu metallization

(4) Fang, J S a Lin, J H a Chen, B Y a Chin, T S b,c

a NATIONAL FORMOSA UNIVERSITY (Taiwan)

b FENG CHIA UNIVERSITY (Taiwan)

c NATIONAL TSING HUA UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER METALLIZATION; CU METALLIZATION; DEPOSITION POWER; FILM COMPOSITION; HIGH THERMAL STABILITY; LOW RESISTIVITY; NANOCRYSTALLINES; TA-C FILM; ULTRA-THIN; ULTRALARGE SCALE INTEGRATION;

METALLIZING; ULSI CIRCUITS;

COPPER;

EID: 78650751238 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.3518411 Document Type: Article

Times cited : (21)

References (24)

1
- 85006981071
- 2nd ed., H. Okamoto and T. B. Massalski, Editors, p, 877, and 1467, American Society of Metals, Materials Park, OH.
- Binary Alloy Phase Diagrams, 2nd ed., H. Okamoto, and, T. B. Massalski, Editors, pp. 527, 877, and 1467, American Society of Metals, Materials Park, OH (1990).
- (1990) Binary Alloy Phase Diagrams , pp. 527

2
- 1842854747
- ESLEF6 1099-0062, 10.1149/1.1605271
- D. Josell, D. Wheeler, C. Witt, and T. P. Moffat, Electrochem. Solid-State Lett. ESLEF6 1099-0062, 6, C143 (2003). 10.1149/1.1605271
- (2003) Electrochem. Solid-State Lett. , vol.6 , pp. 143
- Josell, D.¹ Wheeler, D.² Witt, C.³ Moffat, T.P.⁴

3
- 0142121744
- APPLAB 0003-6951, 10.1063/1.1610256
- M. W. Lane, C. E. Murray, F. R. McFeely, P. M. Vereecken, and R. Rosenberg, Appl. Phys. Lett. APPLAB 0003-6951, 83, 2330 (2003). 10.1063/1.1610256
- (2003) Appl. Phys. Lett. , vol.83 , pp. 2330
- Lane, M.W.¹ Murray, C.E.² McFeely, F.R.³ Vereecken, P.M.⁴ Rosenberg, R.⁵

4
- 4344580459
- ESLEF6 1099-0062, 10.1149/1.1757113
- R. Chan, T. N. Arunagiri, Y. Zhang, O. Chyan, R. M. Wallace, M. J. Kim, and T. Q. Hurd, Electrochem. Solid-State Lett. ESLEF6 1099-0062, 7, G154 (2004). 10.1149/1.1757113
- (2004) Electrochem. Solid-State Lett. , vol.7 , pp. 154
- Chan, R.¹ Arunagiri, T.N.² Zhang, Y.³ Chyan, O.⁴ Wallace, R.M.⁵ Kim, M.J.⁶ Hurd, T.Q.⁷

5
- 27944505607
- JESOAN 0013-4651, 10.1149/1.2039939
- T. N. Arunagiri, Y. Zhang, O. Chyan, M. J. Kim, and T. Q. Hurd, J. Electrochem. Soc. JESOAN 0013-4651, 152, G808 (2005). 10.1149/1.2039939
- (2005) J. Electrochem. Soc. , vol.152 , pp. 808
- Arunagiri, T.N.¹ Zhang, Y.² Chyan, O.³ Kim, M.J.⁴ Hurd, T.Q.⁵

6
- 17044374035
- APPLAB 0003-6951, 10.1063/1.1867560
- T. N. Arunagiri, Y. Zhang, O. Chyan, M. El-Bouanani, M. J. Kim, K. H. Chen, C. T. Wu, and L. C. Chen, Appl. Phys. Lett. APPLAB 0003-6951, 86, 083104 (2005). 10.1063/1.1867560
- (2005) Appl. Phys. Lett. , vol.86 , pp. 083104
- Arunagiri, T.N.¹ Zhang, Y.² Chyan, O.³ El-Bouanani, M.⁴ Kim, M.J.⁵ Chen, K.H.⁶ Wu, C.T.⁷ Chen, L.C.⁸

7
- 31544432585
- APPLAB 0003-6951, 10.1063/1.2167610
- M. Damayanti, T. Sritharan, S. G. Mhaisalkar, and Z. H. Gan, Appl. Phys. Lett. APPLAB 0003-6951, 88, 044101 (2006). 10.1063/1.2167610
- (2006) Appl. Phys. Lett. , vol.88 , pp. 044101
- Damayanti, M.¹ Sritharan, T.² Mhaisalkar, S.G.³ Gan, Z.H.⁴

8
- 43049105801
- JESOAN 0013-4651, 10.1149/1.2905749
- C. W. Chen, J. S. Chen, and J. S. Jeng, J. Electrochem. Soc. JESOAN 0013-4651, 155, H438 (2008). 10.1149/1.2905749
- (2008) J. Electrochem. Soc. , vol.155 , pp. 438
- Chen, C.W.¹ Chen, J.S.² Jeng, J.S.³

9
- 54949094777
- JESOAN 0013-4651, 10.1149/1.2999348
- C. W. Chen, J. S. Chen, and J. S. Jeng, J. Electrochem. Soc. JESOAN 0013-4651, 155, H1003 (2008). 10.1149/1.2999348
- (2008) J. Electrochem. Soc. , vol.155 , pp. 1003
- Chen, C.W.¹ Chen, J.S.² Jeng, J.S.³

10
- 33646391224
- JESOAN 0013-4651, 10.1149/1.2193335
- S. H. Kwon, O. K. Kwon, J. S. Min, and S. W. Kang, J. Electrochem. Soc. JESOAN 0013-4651, 153, G578 (2006). 10.1149/1.2193335
- (2006) J. Electrochem. Soc. , vol.153 , pp. 578
- Kwon, S.H.¹ Kwon, O.K.² Min, J.S.³ Kang, S.W.⁴

11
- 52649158177
- JESOAN 0013-4651, 10.1149/1.2975341
- S. W. Kim, S. H. Kwon, S. J. Jeong, and S. W. Kang, J. Electrochem. Soc. JESOAN 0013-4651, 155, H885 (2008). 10.1149/1.2975341
- (2008) J. Electrochem. Soc. , vol.155 , pp. 885
- Kim, S.W.¹ Kwon, S.H.² Jeong, S.J.³ Kang, S.W.⁴

12
- 70349451843
- IEEE
- N. Tarazawa, T. Hinomura, K. Mori, Y. Koyama, S. Hirao, E. Kobori, H. Korogi, K. Maekawa, K. Tomita, H. Chibahara, in International Interconnect Technology Conference, IEEE, p. 113 (2009).
- (2009) International Interconnect Technology Conference , pp. 113
- Tarazawa, N.¹ Hinomura, T.² Mori, K.³ Koyama, Y.⁴ Hirao, S.⁵ Kobori, E.⁶ Korogi, H.⁷ Maekawa, K.⁸ Tomita, K.⁹ Chibahara, H.¹⁰

13
- 0037091673
- JAPIAU 0021-8979, 10.1063/1.1464652
- T. Aaurila, K. Zeng, J. K. Kivilahti, J. Molarius, and I. Suni, J. Appl. Phys. JAPIAU 0021-8979, 91, 5391 (2002). 10.1063/1.1464652
- (2002) J. Appl. Phys. , vol.91 , pp. 5391
- Aaurila, T.¹ Zeng, K.² Kivilahti, J.K.³ Molarius, J.⁴ Suni, I.⁵

14
- 0031152731
- THSFAP 0040-6090, 10.1016/S0040-6090(97)00057-6
- J. Imahori, T. Oku, and M. Murakami, Thin Solid Films THSFAP 0040-6090, 301, 142 (1997). 10.1016/S0040-6090(97)00057-6
- (1997) Thin Solid Films , vol.301 , pp. 142
- Imahori, J.¹ Oku, T.² Murakami, M.³

15
- 0008988230
- JAPIAU 0021-8979, 10.1063/1.350566
- K. Holloway, P. M. Fryer, C. Cabral, Jr., J. M. E. Harper, P. J. Bailey, and K. H. Kelleher, J. Appl. Phys. JAPIAU 0021-8979, 71, 5433 (1992). 10.1063/1.350566
- (1992) J. Appl. Phys. , vol.71 , pp. 5433
- Holloway, K.¹ Fryer, P.M.² Cabral Jr., C.³ Harper, J.M.E.⁴ Bailey, P.J.⁵ Kelleher, K.H.⁶

16
- 0027840806
- THSFAP 0040-6090, 10.1016/0040-6090(93)90694-K
- X. Sun, E. Kolawa, J. S. Chen, J. S. Reid, and M.-A. Nicolet, Thin Solid Films THSFAP 0040-6090, 236, 347 (1993). 10.1016/0040-6090(93)90694-K
- (1993) Thin Solid Films , vol.236 , pp. 347
- Sun, X.¹ Kolawa, E.² Chen, J.S.³ Reid, J.S.⁴ Nicolet, M.-A.⁵

17
- 50949117666
- IEEE
- D. Jeong, H. Inoue, and H. Shinriki, International Interconnect Technology Conference, IEEE, p. 156 (2008).
- (2008) International Interconnect Technology Conference , pp. 156
- Jeong, D.¹ Inoue, H.² Shinriki, H.³

18
- 0034262476
- THSFAP 0040-6090, 10.1016/S0040-6090(00)01098-1
- D. S. Wuu, C. C. Chan, and R. H. Horng, Thin Solid Films THSFAP 0040-6090, 373, 84 (2000). 10.1016/S0040-6090(00)01098-1
- (2000) Thin Solid Films , vol.373 , pp. 84
- Wuu, D.S.¹ Chan, C.C.² Horng, R.H.³

19
- 33645242362
- ASUSDD 0378-5963, 10.1016/j.apsusc.2005.09.042
- H. Kim, T. Koseki, T. Ohba, T. Ohta, Y. Kojima, H. Sato, S. Hosaka, and Y. Shimogaki, Appl. Surf. Sci. ASUSDD 0378-5963, 252, 3938 (2006). 10.1016/j.apsusc.2005.09.042
- (2006) Appl. Surf. Sci. , vol.252 , pp. 3938
- Kim, H.¹ Koseki, T.² Ohba, T.³ Ohta, T.⁴ Kojima, Y.⁵ Sato, H.⁶ Hosaka, S.⁷ Shimogaki, Y.⁸

20
- 79956043837
- APPLAB 0003-6951, 10.1063/1.1447601
- T. Laurila, K. Zeng, J. K. Kivilahti, J. Molarius, and I. Suni, Appl. Phys. Lett. APPLAB 0003-6951, 80, 938 (2002). 10.1063/1.1447601
- (2002) Appl. Phys. Lett. , vol.80 , pp. 938
- Laurila, T.¹ Zeng, K.² Kivilahti, J.K.³ Molarius, J.⁴ Suni, I.⁵

21
- 0038420254
- C. B. Alcock and D. R. Lide, Editors, p, CRC, Boca Raton, FL.
- CRC Handbook of Chemistry and Physics, C. B. Alcock, and, D. R. Lide, Editors, pp. 5-72, CRC, Boca Raton, FL (1995).
- (1995) CRC Handbook of Chemistry and Physics , pp. 5-72

22
- 33847718761
- BUMSDW 0250-4707, 10.1007/s12034-007-0005-x
- L. S. Panchakarla and A. Govindaraj, Bull. Mater. Sci. BUMSDW 0250-4707, 30, 23 (2007). 10.1007/s12034-007-0005-x
- (2007) Bull. Mater. Sci. , vol.30 , pp. 23
- Panchakarla, L.S.¹ Govindaraj, A.²

23
- 31644449668
- SCTEEJ 0257-8972, 10.1016/j.surfcoat.2005.07.012
- H. C. Chung and C. P. Liu, Surf. Coat. Technol. SCTEEJ 0257-8972, 200, 3122 (2006). 10.1016/j.surfcoat.2005.07.012
- (2006) Surf. Coat. Technol. , vol.200 , pp. 3122
- Chung, H.C.¹ Liu, C.P.²

24
- 33646131179
- APPLAB 0003-6951, 10.1063/1.2195112
- X. P. Qu, J. J. Tan, M. Zhou, T. Chen, Q. Xie, G. P. Ru, and B. Z. Li, Appl. Phys. Lett. APPLAB 0003-6951, 88, 151912 (2006). 10.1063/1.2195112
- (2006) Appl. Phys. Lett. , vol.88 , pp. 151912
- Qu, X.P.¹ Tan, J.J.² Zhou, M.³ Chen, T.⁴ Xie, Q.⁵ Ru, G.P.⁶ Li, B.Z.⁷

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.