Improvement on the diffusion barrier performance of reactively sputtered Ru-N film by incorporation of Ta

Journal of the Electrochemical Society

Volumn 155, Issue 6, 2008, Pages

  Chen, Chun Wei ^a   Chen, J S ^a,c   Jeng, Jiann Shing ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b FAR EAST UNIVERSITY   (Taiwan)

^c ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; AUGER ELECTRON SPECTROSCOPY; REACTIVE SPUTTERING; RUTHENIUM COMPOUNDS; SHEET RESISTANCE;

CHEMICAL STATES; FILM DEPOSITION;

DIFFUSION BARRIERS;

EID: 43049105801     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2905749     Document Type: Article

References (20)

1. E. R. Weber, Appl. Phys. A, 30, 1 (1983).
2. J. D. McBrayer, R. M. Swanson, and T. W. Sigmon, J. Electrochem. Soc., 133, 1242 (1986).
3. W. F. Wu, K. L. Ou, C. P. Chou, and C. C. Wu, J. Electrochem. Soc., 150, G83 (2003).
4. K. M. Latt, Y. K. Lee, S. Li, T. Osipowicz, and H. L. Seng, Mater. Sci. Eng., B, 84, 217 (2001).
5. K. H. Min, K. C. Chun, and K. B. Kim, J. Vac. Sci. Technol. B, 14, 3263 (1996).
6. K. C. Park and K. B. Kim, J. Electrochem. Soc., 147, 2711 (2000).
7. E. Kolawa, J. S. Chen, J. S. Reid, P. J. Pokela, and M. A. Nicolet, J. Appl. Phys., 70, 1369 (1991).
8. International Technology Roadmap for Semiconductors-2006 Updates, http://www.itrs.net/Links/2006Update/FinalToPost/09_Interconnect2006Update.pdf (last accessed on April 10, 2008).
9. Binary Alloy Phase Diagrams, 2nd ed., T. B. Massalski, Editor-in-Chief, p. 1467, AMS International, Materials Park, OH (1990).
10. M. W. Lane, C. E. Murray, F. R. McFeely, P. M. Vereecken, and R. Rosenberg, Appl. Phys. Lett., 83, 2330 (2003).
11. O. Chyan, T. N. Arunagiri, and T. Ponnuswamy, J. Electrochem. Soc., 150, C347 (2003).
12. T. N. Arunagiri, Y. Zhang, O. Chyan, M. J. Kim, and T. Q. Hurd, J. Electrochem. Soc., 152, G808 (2005).
13. M. Damayanti, T. Sritharan, Z. H. Gan, S. G. Mhaisalkar, N. Jiang, and L. Chan, J. Electrochem. Soc., 153, J41 (2006).
14. M. Thompson and L. Doolittle, RUMP-RBS Analysis and Simulation Package [v 4.00 (beta)], Computer Graphic Service, Ltd. (Feb. 7, 2008).
15. M. Damayanti, T. Sritharan, S. G. Mhaisalkar, and Z. H. Gan, Appl. Phys. Lett., 88, 044101 (2006).
16. S. Rawal, D. P. Norton, H. Ajmera, T. J. Anderson, and L. McElwee-White, Appl. Phys. Lett., 90, 051913 (2007).
17. A. Arranz and C. Palacio, Appl. Phys. A, 81, 1405 (2005).
18. Y. Kuo, J. Electrochem. Soc., 139, 579 (1992).
19. C. C. Chang, J. S. Jeng, and J. S. Chen, Thin Solid Films, 413, 46 (2002).
20. P. Aĺn, M. Vehkamäki, M. Ritala, and M. Leskelä, J. Electrochem. Soc., 153, G304 (2006).