Copper-plated 50 nm T -gate fabrication

Journal of Vacuum Science and Technology B

Volumn 28, Issue 6, 2010, Pages

  Oxland, Richard K ^a   Li, Xu ^a   Ferguson, Susan ^a   Bentley, Steven ^a   Thayne, Iain G ^a  

^a UNIVERSITY OF GLASGOW   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRON BEAM LITHOGRAPHY; ELECTROPLATING; SILICON NITRIDE;

COMPATIBLE PROCESS; COPPER ELECTROPLATING; CU-BASED; ETCH PROCESS; HIGH-RESOLUTION ELECTRON BEAM LITHOGRAPHY; LOW DAMAGES; PROCESS FLOWS; SEED LAYER; SUB-100 NM; T-GATES;

FABRICATION;

EID: 78650155205     PISSN: 21662746     EISSN: 21662754     Source Type: Journal    
DOI: 10.1116/1.3501346     Document Type: Article

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