Retraction notice to “Microstructural, mechanical and electrochemical corrosion properties of sputtered titanium–aluminum- nitride films for bio- implants” [Vacuum (2010) 601–609] (Vacuum (2010) 85(5) (601–609), (S0042207X10002691), (10.1016/j.vacuum.2010.08.019));Microstructural, mechanical and electrochemical corrosion properties of sputtered titanium-aluminum-nitride films for bio-implants

Vacuum

Volumn 85, Issue 5, 2010, Pages 601-609

  Subramanian, Balasubramanian ^a   Ananthakumar, Ramadoss ^a   Jayachandran, Muthirulandi ^a  

^a CENTRAL ELECTROCHEMICAL RESEARCH INSTITUTE   (India)

Author keywords

Corrosion resistance; Hard thin film; Nanohardness; Sputtering; Wear; XPS

Indexed keywords

ALUMINUM COATED STEEL; ALUMINUM CORROSION; ALUMINUM NITRIDE; BLOOD; CARBON FILMS; CORROSION RESISTANCE; CORROSIVE EFFECTS; ELECTROCHEMICAL CORROSION; FRICTION; III-V SEMICONDUCTORS; LOW CARBON STEEL; NANOHARDNESS; SILICON WAFERS; SPUTTERING; SUBSTRATES; THIN FILMS; TITANIUM NITRIDE; WEAR OF MATERIALS; X RAY PHOTOELECTRON SPECTROSCOPY;

AISI316L STAINLESS STEEL; BLOOD PLATELET ADHESIONS; COEFFICIENT OF FRICTIONS; DIRECT CURRENT MAGNETRON SPUTTERING; ELECTROCHEMICAL CORROSION PROPERTIES; HARD THIN FILMS; TITANIUM ALUMINUM NITRIDE; TITANIUM ALUMINUM NITRIDE FILM;

CORROSION RESISTANT COATINGS;

EID: 78649636799     PISSN: 0042207X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.vacuum.2020.109923     Document Type: Erratum

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