Low-Cycle Fatigue Characteristics of Sn-Based Solder Joints

Journal of Electronic Materials

Volumn 33, Issue 4, 2004, Pages 249-257

  Lee, K O ^a   Yu, Jin ^a   Park, T S ^a   Lee, S B ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Coffin Manson relationship; Lead free solder; Low cycle fatigue; Morrow energy mode; Solomon parameter

Indexed keywords

ENERGY DISSIPATION; FATIGUE OF MATERIALS; HARDNESS; INTERFACES (MATERIALS); INTERMETALLICS; LEAD ALLOYS; METALLURGY; PLASTICITY; PRINTED CIRCUIT BOARDS; STIFFNESS; TIN;

COFFIN-MANSON RELATIONSHIP; LEAD-FREE SOLDERS; LOW-CYCLE FATIGUE; MORROW ENERGY MODE; SOLOMON PARAMETERS;

SOLDERED JOINTS;

EID: 2342465577     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0130-x     Document Type: Article

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