A grinding-based manufacturing method for silicon wafers: Generation mechanisms of central dimples on ground wafers

International Journal of Machine Tools and Manufacture

Volumn 46, Issue 3-4, 2006, Pages 397-403

  Zhang, X H ^a   Pei, Z J ^a   Fisher, Graham R ^b  

^a Sunflower Networking Group   (United States)

^b MEMC Electronic Materials Inc   (United States)

Author keywords

Grinding; Lapping; Machining; Manufacturing; Material removal; Semiconductor material; Silicon wafer

Indexed keywords

ELASTIC MODULI; FINITE ELEMENT METHOD; INTEGRATED CIRCUITS; LAPPING; MATHEMATICAL MODELS; SILICON WAFERS;

MATERIAL REMOVAL; SEMICONDUCTOR MATERIAL; SILICON WAFER;

GRINDING (COMMINUTION);

EID: 29244434820     PISSN: 08906955     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijmachtools.2005.05.008     Document Type: Article

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