In-process force monitoring for precision grinding semiconductor silicon wafers

International Journal of Manufacturing Technology and Management

Volumn 7, Issue 5-6, 2005, Pages 430-440

  Couey, Jeremiah A ^a,d   Marsh, Eric R ^a   Knapp, Byron R ^b,e   Ryan Vallance, R ^c  

^a PENNSYLVANIA STATE UNIVERSITY   (United States)

^b Olympic Laser Inc   (United States)

^c GEORGE WASHINGTON UNIVERSITY   (United States)

^d DALHOUSIE UNIVERSITY   (Canada)

^e Olympic Precision   (United States)

Author keywords

Grinding process monitoring; Grinding sensors; Silicon wafer grinding

Indexed keywords

GRINDING MACHINES; SENSITIVITY ANALYSIS; SENSORS; SIGNAL PROCESSING; STIFFNESS;

AEROSTATIC SPINDLE; DISPLACEMENT SENSORS; PRECISION WAFER GRINDING; PROCESS MONITORING;

CONDITION MONITORING;

EID: 28844492634     PISSN: 13682148     EISSN: None     Source Type: Journal    
DOI: 10.1504/IJMTM.2005.007695     Document Type: Article

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