SCOPUS 정보 검색 플랫폼

Key Engineering Materials

Volumn 416, Issue , 2009, Pages 529-534

Study on grinding performance of soft abrasive wheel for silicon wafer

(4) Kang, Renke a Gao, Shang a Jin, Zhuji a Guo, Dongming a

a DALIAN UNIVERSITY OF TECHNOLOGY (China)

Author keywords

Grinding; Silicon wafer; Soft abrasive wheel; Subsurface damage

Indexed keywords

ABRASIVES; ADDITIVES; CHEMICAL REACTIONS; DIAMONDS; ENVIRONMENTAL TECHNOLOGY; GRINDING (MACHINING); GRINDING WHEELS; SILICON WAFERS; SURFACE ROUGHNESS; WAFER BONDING; WHEELS;

ENVIRONMENTAL POLLUTIONS; GRINDING PERFORMANCE; IC MANUFACTURING TECHNOLOGIES; MATERIAL REMOVAL RATE; MECHANICAL FRICTION; PLANARIZATION TECHNIQUE; QUALITY OF SILICONS; SUB-SURFACE DAMAGE;

AMORPHOUS SILICON;

EID: 70349684353 PISSN: 10139826 EISSN: 16629795 Source Type: Book Series
DOI: 10.4028/www.scientific.net/KEM.416.529 Document Type: Conference Paper

Times cited : (15)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.