Transformation of silica fume into chemical mechanical polishing (CMP) nano-slurries for advanced semiconductor manufacturing

Powder Technology

Volumn 205, Issue 1-3, 2011, Pages 149-154

  Rashad, M M ^a   Hessien, M M ^a   Abdel Aal, E A ^a   El Barawy, K ^a   Singh, R K ^b  

^a CENTRAL METALLURGICAL RESEARCH AND DEVELOPMENT INSTITUTE CMRDI   (Egypt)

^b UNIVERSITY OF FLORIDA   (United States)

Author keywords

Advanced semiconductors; Chemical mechanical polishing; Chemical processing; Silica nanopowders; Size distribution

Indexed keywords

ADVANCED SEMICONDUCTORS; APPLIED PRESSURE; ATOMIC FORCE MICROSCOPES; CHEMICAL PROCESSING; DISSOLUTION-PRECIPITATION PROCESS; NAOH SOLUTIONS; POLISHED WAFERS; REMOVAL RATE; SEMICONDUCTOR MANUFACTURING; SILICA MORPHOLOGY; SILICA NANOPARTICLES; SODIUM DODECYL SULFATE; SODIUM SILICATE SOLUTIONS; SPHERICAL SHAPE;

ALKALINITY; CHEMICAL INDUSTRY; CHEMICAL MECHANICAL POLISHING; DISSOLUTION; MORPHOLOGY; NANOPARTICLES; NANOSTRUCTURED MATERIALS; PARTICLE SIZE ANALYSIS; POLISHING; PRECIPITATION (CHEMICAL); SILICA; SILICA FUME; SILICATES; SILICON WAFERS; SIZE DISTRIBUTION; SODIUM; SODIUM SULFATE; SULFURIC ACID; SURFACE PROPERTIES; SURFACE ROUGHNESS;

CHEMICAL POLISHING;

DODECYL SULFATE SODIUM; NANOPARTICLE; SILICON DIOXIDE; SODIUM HYDROXIDE; SULFURIC ACID;

ARTICLE; DISSOLUTION; FUME; MORPHOLOGY; PARTICLE SIZE; PRECIPITATION; SEMICONDUCTOR; SYNTHESIS; TEMPERATURE;

EID: 78049272186     PISSN: 00325910     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.powtec.2010.09.005     Document Type: Article

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