Process characterization and statistical analysis of oxide CMP on a silicon wafer with sparse data

Applied Physics A: Materials Science and Processing

Volumn 88, Issue 4, 2007, Pages 785-792

  Bukkapatnam, S T S ^a   Rao, P K ^a   Lih, W C ^a,b   Chandrasekaran, N ^c   Komanduri, R ^a  

^a OKLAHOMA STATE UNIVERSITY   (United States)

^b NATIONAL DEFENSE UNIVERSITY   (Taiwan)

^c MICRON TECHNOLOGY INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; COPPER; DIELECTRIC MATERIALS; STATISTICAL METHODS;

MATERIAL REMOVAL RATE (MRR); MINIMUM WITHIN WAFER NON-UNIFORMITY (WIWNU);

SILICON WAFERS;

EID: 34547260339     PISSN: 09478396     EISSN: 14320630     Source Type: Journal    
DOI: 10.1007/s00339-007-4082-x     Document Type: Article

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