Finite-element analysis on wafer-level CMP contact stress: Reinvestigated issues and the effects of selected process parameters

International Journal of Advanced Manufacturing Technology

Volumn 42, Issue 11-12, 2009, Pages 1118-1130

  Chen, K S ^a   Yeh, H M ^a   Yan, J L ^a   Chen, Y T ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

CMP; Contact stress; Finite element analysis

Indexed keywords

CARRIER FILMS; CHEMICAL-MECHANICAL PLANARIZATION; CMP; COMPUTER-AIDED DESIGN SYSTEMS; CONTACT ANALYSIS; CONTACT STRESS; CONTACT STRESS ANALYSIS; CONTACT STRESS DISTRIBUTIONS; EFFECTS OF MATERIALS; FINITE-ELEMENT ANALYSIS; GRAPHIC USER INTERFACE; HYPER-ELASTICITY; KEY ISSUES; NORMAL STRESS; ON-WAFER; PAD DEFORMATION; PAD GROOVE; PAD MATERIAL; PROCESS PARAMETERS; STRESS DISTRIBUTION; STRESS INDICATORS; VON MISES; WAFER LEVEL; WAFER WARPAGE;

COMPUTER AIDED ANALYSIS; COMPUTER AIDED DESIGN; ELASTICITY; FINITE ELEMENT METHOD; INTERFACES (COMPUTER); NANOTECHNOLOGY; STRENGTH OF MATERIALS; STRESS CONCENTRATION;

STRESS ANALYSIS;

EID: 67650270108     PISSN: 02683768     EISSN: 14333015     Source Type: Journal    
DOI: 10.1007/s00170-008-1672-5     Document Type: Article

References (28)

1. PB Zantye A Kumar AK Sikder 2004 Chemical mechanical planarization for microelectronics applications Mater Sci Eng Rep 45 89 220
2. AT Kim J Seok JA Tichy TS Cale 2003 A multiscale elastohydrodynamic contact model for CMP J Electrochem Soc 150 G570 G576
3. F Preston 1927 Optimization of computer controlled polishing Glass Tech 11 214 219
4. C Zhou L Shan JR Hight SH Ng S Danyluk 2002 Fluid pressure and its effects on chemical mechanical polishing Wear 253 3-4 430 437 (Pubitemid 35157031)
5. Maury A, Ouma D, Boning D, Chung J (1997) A modification to Preston's equation and impact on pattern density effect modeling. Program Abstracts, Advanced Metalization and Interconnect Systems for ULSI Applications
6. F Zhang A Busnaina 1998 The role of particle adhesion and surface deformation in chemical mechanical polishing processes Electrochem Solid-State Lett 1 4 184 187 (Pubitemid 128558390)
7. Zhao B, Shi FG (1999) Chemical mechanical polishing in IC processes: new fundamental insights. In: 1999 CMP-MIC conference, Santa Clara, CA, USA, pp 13-22
8. SR Runnels I Kim J Schleuter C Karlsrud M Desai 1998 A modeling tool for chemical-mechanical polishing design and evaluation IEEE Trans Semicond Manuf 11 501 510 (Pubitemid 128742389)
9. C Srinivasa-Murthy D Wang SP Beaudoin T Bibby K Holland T Cale 1997 Stress distribution in chemical-mechanical polishing Thin Solid Films 308 533 537
10. D Wang J Lee K Holland T Bibby S Beaudoin T Cale 1997 Von Mises stress in chemical-mechanical polishing processes J Electrochem Soc 144 1122 1127
11. YY Lin SP Lo 2003 A study on the stress and nonuniformity of the wafer surface for the chemical-mechanical polishing process Int J Adv Manuf Technol 22 401 409
12. YY Lin SP Lo 2004 A study of a finite element model for the chemical mechanical polishing process Int J Adv Manuf Technol 23 644 650
13. SP Lo YY Lin 2005 The prediction of wafer surface non-uniformity using FEM and ANFIS in the chemical mechanical polishing process J Mater Process Technol 168 250 257
14. JT Chiu YY Lin 2008 Modal analysis of multi-layer structure for chemical mechanical polishing process Int J Adv Manuf Technol 37 83 91
15. SP Lo YY Lin JC Huang 2007 Analysis of retaining ring using finite element simulation in chemical mechanical polishing process Int J Adv Manuf Technol 34 547 555
16. G Fu A Chandra 2005 The relationship between wafer surface pressure and wafer backside loading in chemical mechanical polishing Thin Solid Films 474 217 221
17. WT Tseng YH Wang JH Chin 1999 Effects of film stress on the chemical mechanical polishing process J Electrochem Soc 146 4273 4280
18. SJ Shiu CC Yu 2004 Multivariable control of multizone chemical mechanical polishing J Vac Sci Technol B 22 4 1679 1687
19. Liao YM, Yan HY, Wang FJ, Chen KS (2006) Mechanical properties characterization for CMP pads. In: 23rd National Conference of the Chinese Society of Mechanical Engineers, Tainan, Taiwan
20. Hibbit D, Karlsson B, Sorensen P (1998) ABAQUS/standard 5.8 user's manual. Hibbit, Karlsson, and Sorensen, Pawtucket
21. Johhnson KL (1985) Contact mechanics. Cambridge University Press, Cambridge
22. SR Runnels P Renteln 1993 Modeling the effect of polish pad deformation on wafer surface stress distributions during chemical-mechanical polishing Dielect Sci Technol 6 110 121
23. AR Baker 1997 The origin of the edge effects in CMP Proc Electrochem Soc 96 228 237
24. Cook RD, Young WC (1999) Advanced mechanics of materials. Prentice-Hall, Upper Saddle River
25. Ling FF, Lai WM, Lucca DA (2002) Fundamentals of surface mechanics: with applications. Springer, New York
26. GG Stoney 1909 The tension of thin metallic film deposited by electrolysis Proc R Soc Lond, A Contain Pap Math Phys Character 82 553 172 175
27. Hubbard TJ, Antonsson EK (1997) Cellular automata in MEMS design. In Sens Mater Conf, Tokyo, Japan vol. 7, pp 437-448
28. YC Wang TS Yang 2007 Effects of pad grooves on chemical mechanical planarization J Electrochem Soc 154 6 H486 H494