Effect of nano-size silica abrasives in chemical mechanical polishing of copper

Materials Research Society Symposium Proceedings

Volumn 816, Issue , 2004, Pages 49-52

  Jung, Su Ho ^a   Singh, Rajiv K ^a,b  

^a University of Florida   (United States)

^b The University of Texas at Austin   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; ATOMIC FORCE MICROSCOPY; COPPER; CORRELATION METHODS; ETCHING; NANOSTRUCTURED MATERIALS; PASSIVATION; SILICA; X RAY PHOTOELECTRON SPECTROSCOPY;

ETCH RATES; REMOVAL RATE; STRESS POLISHING; SURFACE LAYERS;

CHEMICAL MECHANICAL POLISHING;

EID: 12744281833     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-816-k1.8     Document Type: Conference Paper

References (8)

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