High fidelity hot-embossing of COC microdevices using a one-step process without pre-annealing of polymer substrate

Sensors and Actuators, B: Chemical

Volumn 150, Issue 2, 2010, Pages 692-699

  Jena, Rajeeb K ^a,b   Yue, C Y ^a,b   Lam, Y C ^a,b   Wang, Z Y ^a,b  

^a SINGAPORE MIT ALLIANCE   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

COC; High fidelity; Hot embossing; Microchannels; Polymer chain orientation; Polymer microfabrication

Indexed keywords

COC; HIGH FIDELITY; HOT-EMBOSSING; POLYMER CHAIN ORIENTATION; POLYMER MICROFABRICATION;

ANNEALING; FLUIDIC DEVICES; MICROANALYSIS; MICROCHANNELS; MICROFABRICATION; MICROFLUIDICS; MICROMACHINING; OLEFINS; POLYMERS; RESIDUAL STRESSES; SUBSTRATES;

POLYMER FILMS;

EID: 77958473652     PISSN: 09254005     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.snb.2010.08.018     Document Type: Article

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