Fabrication of a microchannel device by hot embossing and direct bonding of poly(methyl methacrylate)

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 46, Issue 6 A, 2007, Pages 3661-3664

  Shinohara, Hidetoshi ^a   Mizuno, Jun ^a   Shoji, Shuichi ^a  

^a WASEDA UNIVERSITY   (Japan)

Author keywords

Direct bonding; Hot embossing; Microchannel; Poly(methyl methacrylate); Silicon mold

Indexed keywords

DEIONIZED WATER; FLUIDICS; LIGHT ABSORPTION; OPTICAL LOSSES; OPTICAL PROPERTIES; POLYMETHYL METHACRYLATES; ULTRASONIC CLEANING;

DIRECT BONDING; SILICON MOLDS;

MICROCHANNELS;

EID: 34547850210     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.46.3661     Document Type: Article

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