Hot embossing of microfluidic platform

International Communications in Heat and Mass Transfer

Volumn 33, Issue 5, 2006, Pages 645-653

  Chien, Rean Der ^a  

^a NANYA INSTITUTE OF TECHNOLOGY   (Taiwan)

Author keywords

Hot embossing; Microfeature; Micromolding

Indexed keywords

FABRICATION; MOLDING; NICKEL ALLOYS; STAMPING; THERMAL EFFECTS;

HOT EMBOSSING; MICROCHANNEL ARRAY; MICROFLUIDIC PLATFORM; MICROMOLDING;

FLUIDIC DEVICES;

FABRICATION; FLUIDIC DEVICES; MOLDING; NICKEL ALLOYS; STAMPING; THERMAL EFFECTS;

EID: 33646248625     PISSN: 07351933     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.icheatmasstransfer.2006.01.017     Document Type: Article

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