Characterisation of PMMA microfluidic channels and devices fabricated by hot embossing and sealed by direct bonding

Current Applied Physics

Volumn 9, Issue 6, 2009, Pages 1199-1202

  Mathur, A ^a   Roy, S S ^a   Tweedie, M ^a   Mukhopadhyay, S ^a   Mitra, S K ^b   McLaughlin, J A ^a  

^a UNIVERSITY OF ULSTER   (United Kingdom)

^b UNIVERSITY OF ALBERTA   (Canada)

Author keywords

Hot embossing; Microfluidics; Surface energy; Surface roughening; Thermal bonding

Indexed keywords

APPLIED FORCES; CHARACTERISATION; DIRECT BONDING; HOT EMBOSSING; MASK LESS; MICRO-FEATURE; MICROCHANNEL ARRAY; MICROFLUIDIC CHANNEL; SILICON-BASED; SURFACE ENERGY; SURFACE ROUGHENING; THERMAL BONDING; THERMAL IMPRINT; UV LITHOGRAPHY;

ESTERS; INTERFACIAL ENERGY; MICROCHANNELS; MICROFLUIDICS; PHOTORESISTS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SURFACE CHEMISTRY; SURFACE TENSION;

SUBSTRATES;

EID: 67349247806     PISSN: 15671739     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.cap.2009.01.007     Document Type: Article

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