메뉴 건너뛰기




Volumn 88, Issue 5, 2010, Pages 248-255

Pulse plating of matt tin: Effect on properties

Author keywords

Current efficiency; Grain orientation; Pulsed current; Surface morphology; Tin electrodeposition

Indexed keywords

AVERAGE GRAIN SIZE; CROSS SECTION MICROSTRUCTURE; CURRENT EFFICIENCY; DIRECT CURRENT; DUTY CYCLES; EFFECT SIZE; GRAIN ORIENTATION; GRAIN SIZE; GRAIN STRUCTURES; METHANESULPHONATE; ON CURRENTS; OPERATING RANGES; PULSE FREQUENCIES; PULSE PLATING; PULSED CURRENTS; TIN COATING;

EID: 77957797092     PISSN: 00202967     EISSN: None     Source Type: Journal    
DOI: 10.1179/002029610X12791981507802     Document Type: Article
Times cited : (14)

References (36)
  • 28
    • 77957789399 scopus 로고    scopus 로고
    • http://www.atotech.com/en/products/electronics/panel-pattern-plating/ tin-plating/vertical-tin-plating.html


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.