A new fine-grained matte pure tin for semiconductor lead-frame applications

Circuit World

Volumn 32, Issue 1, 2005, Pages 23-30

  Whitlaw, Keith ^a   Crosby, Jeff ^a   Toben, Mike ^a  

^a ROHM AND HAAS COMPANY   (United States)

Author keywords

Coating processes; Ductility; Semiconductors; Soldering

Indexed keywords

COATING TECHNIQUES; COATINGS; CRYSTAL MICROSTRUCTURE; CRYSTAL ORIENTATION; CRYSTAL WHISKERS; DUCTILITY; GRAIN SIZE AND SHAPE; SCANNING ELECTRON MICROSCOPY; SOLDERING; TIN; TINNING; X RAY DIFFRACTION ANALYSIS; PROTECTIVE COATINGS; SINGLE CRYSTALS;

SEMICONDUCTOR LEAD-FRAME; SOLDERABILITY; TIN COATINGS; FINE-GRAINED STRUCTURE; TIN COATING;

PRINTED CIRCUIT BOARDS; INTEGRATED CIRCUIT MANUFACTURE;

EID: 25844476811     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120610616526     Document Type: Article

References (10)

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2. Dittes, M., Oberndorff, P., Crema, P. and Chopin, S. (2004), "A two step approach for the release of lead free component finishes with respect to whisker risk", paper presented at the IPC and JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, October.
3. Egli, A., Zhang, W., Heber, J., Schwager, F. and Toben, M. (2002), "Where crystal planes meet: Contribution to the understanding of the tin whisker growth process", IPC Annual Meeting, New Orleans, LA, November.
4. IPC/EIA/JEDEC (2003), J-STD-002B Joint Industry Standard Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires, IPC/E1A/JEDEC, February, p. 2.
5. Motorola Ductility Test Tool Set (1997), Dwg. No. P9516301 and Dwg. No. P9516302; 12MRH70740A, Motorola Final Manufacturing Operation, October.
6. Oberndorff, P.J.T.L., Dittes, M. and Petit, L. (2003), "Intermetallic formation in relation to tin whisker", paper presented at the IPC and Soldertec Global Conference on Lead Free Electronics Towards Implementation of the RoHS Directive, Brussels, June.
7. Solderon™ (n.d.a), "ST-380 tin plating process, proprietary process of Rohm and Haas Electronic Materials, LLC", Packaging & Finishing Technologies Division, Freeport, NY.
8. Solderon™ (n.d.b), "SC acid tin-lead, proprietary process of Rohm and Haas Electronic Materials, LLC", Packaging & Finishing Technologies Division, Freeport, NY.
9. Solderon™ (n.d.c), "ST-300, proprietary process of Rohm and Haas Electronic Materials, LLC", Packaging & Finishing Technologies Division, Freeport, NY.
10. Whitlaw, K.J., Egli, A. and Toben, M. (2004), "Preventing whiskers in electrodeposited tin for semiconductor lead frame applications", Circuit World, Vol. 30 No. 2, pp. 20-4.