Effect of nitrogen flow ratios on the structure and mechanical properties of (TiVCrZrY)N coatings prepared by reactive magnetron sputtering

Applied Surface Science

Volumn 257, Issue 4, 2010, Pages 1361-1367

  Tsai, Du Cheng ^a   Huang, Yen Lin ^a   Lin, Sheng Ru ^a   Liang, Shih Chang ^a   Shieu, Fuh Sheng ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

Coating materials; Crystal structure; Microstructure; Nitride materials; Thin films; Vapor deposition

Indexed keywords

ATOMIC FORCE MICROSCOPY; CHEMICAL ANALYSIS; COATINGS; CRYSTAL MICROSTRUCTURE; CRYSTAL STRUCTURE; ELECTRON SPECTROSCOPY; FIELD EMISSION MICROSCOPES; FILM PREPARATION; FILMS; HARDENING; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; MAGNETRON SPUTTERING; MECHANICAL PROPERTIES; MICROSTRUCTURE; NITRIDES; NITROGEN; SCANNING ELECTRON MICROSCOPY; SODIUM CHLORIDE; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY; VAPOR DEPOSITION; X RAY DIFFRACTION;

COATING MATERIAL; COLUMNAR CRYSTAL STRUCTURES; ELECTRON SPECTROSCOPY FOR CHEMICAL ANALYSIS; FIELD EMISSION SCANNING ELECTRON MICROSCOPY; NITRIDE MATERIALS; REACTIVE MAGNETRON SPUTTERING; SODIUM CHLORIDE (NACL); SOLID SOLUTION STRUCTURES;

CRYSTAL ATOMIC STRUCTURE;

EID: 77957163431     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2010.08.078     Document Type: Article

References (26)

1. Y. Xi, H. Fan, and W. Liu J. Alloy Compd. 496 2010 695 698
2. K.W. Weng, Y.C. Chen, S. Han, C.S. Hsu, Y.L. Chen, and D.Y. Wang Thin Solid Films 516 2008 5330 5333
3. Z.Y. Chen, Z.Q. Li, and X.H. Meng Appl. Surf. Sci. 255 2009 7408 7413
4. J.T. Chen, J. Wang, F. Zhang, G.A. Zhang, X.Y. Fan, Z.G. Wu, and P.X. Yan J. Alloy Compd. 472 2009 91 96
5. X.Z. Ding, X.T. Zeng, Y.C. Liu, F.Z. Fang, and G.C. Lim Thin Solid Films 516 2008 1710 1715
6. V.M. Vishnyakov, V.I. Bachurin, K.F. Minnebaev, R. Valizadeh, D.G. Teer, J.S. Colligon, V.V. Vishnyakov, and V.E. Yurasova Thin Solid Films 497 2006 189 195
7. S.M. Aouadi, K.C. Wong, K.A.R. Mitchell, F. Namavar, E. Tobin, D.M. Mihut, and S.L. Rohde Appl. Surf. Sci. 229 2004 387 394
8. M. Uchida, N. Nihira, A. Mitsuo, K. Toyoda, K. Kubota, and T. Aizawa Surf. Coat. Technol. 177-178 2004 627 630
9. H. Hasegawa, A. Kimura, and T. Suzuki J. Vac. Sci. Technol. A 18 2000 1038 1040
10. J. Musil, and H. Polkov Surf. Coat. Technol. 127 2000 99 106
11. C.K. Chung, and T.S. Chen J. Electrochem. Soc. 156 2009 H119 H122
12. R.M. Mason, and M. Pichiling J. Phys. D: Appl. Phys. 27 1994 2363 2371
13. D.C. Tsai, F.S. Shieu, S.Y. Chang, H.C. Yao, and M.J. Deng J. Electrochem. Soc. 157 2010 K52 K58
14. M.Y. Liao, Y. Gotoh, H. Tsuji, and J. Ishikawa J. Vac. Sci. Technol. A 22 2004 146 150
15. M.M. Larijani, N. Tabrizi, Sh. Norouzian, A. Jafari, S. Lahouti, H. Haj Hosseini, and N. Afshari Vacuum 81 2006 550 555
16. J.S. Jeng, and J.S. Chen Appl. Surf. Sci. 255 2009 8263 8269
17. J. Pelleg, L.Z. Zevin, S. Lungo, and N. Croitoru Thin Solid Films 197 1991 117
18. T.Q. Li, S. Noda, H. Komiyama, T. Yamamoto, and Y. Ikuhara J. Vac. Sci. Technol. A 21 2003 1717 1723
19. J.H. Je, D.Y. Noh, H.K. Kim, and K.S. Liang J. Appl. Phys. 81 1997 6126 6133
20. J.E. Greene, J.-E. Sundgren, L. Hultman, I. Petrov, and D.B. Bergstrom Appl. Phys. Lett. 67 1995 2928 2930
21. L. Hultman, J.-E. Sundgren, J.E. Greene, D.B. Bergstrom, and I. Petrov J. Appl. Phys. 78 1995 5395 5403
22. P.K. Huang, and J.W. Yeh Surf. Coat. Technol. 203 2009 1891 1896
23. F. Shinoki, and A. Itoh J. Appl. Phys. 46 1975 3381 3384
24. P.K. Huang, J.W. Yeh, T.T. Shun, and S.K. Chen Adv. Eng. Mater. 6 2004 74 78
25. J.W. Yeh, S.K. Chen, S.J. Lin, J.Y. Gan, T.S. Chin, T.T. Shun, C.H. Tsau, and S.Y. Chang Adv. Eng. Mater. 6 2004 299 303
26. H.L. Wang, C.H. Lin, and M.H. Hon Thin Solid Films 310 1997 260 264