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Volumn 496, Issue 1-2, 2010, Pages 695-698
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The effect of annealing treatment on microstructure and properties of TiN films prepared by unbalanced magnetron sputtering
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Author keywords
Annealing treatment; Crystal structure; TiN; Unbalanced magnetron sputtering
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Indexed keywords
AFTER-HEAT TREATMENT;
ANNEALING TEMPERATURES;
ANNEALING TREATMENT;
ANNEALING TREATMENTS;
CRYSTALLINITIES;
GRAIN SIZE;
IN-VACUUM;
MAXIMUM VALUES;
MICROSTRUCTURE AND PROPERTIES;
PROCESSING PARAMETERS;
SEM;
SI WAFER;
SPUTTERING TECHNIQUES;
TIN FILMS;
TIN THIN FILMS;
UNBALANCED MAGNETRON;
UNBALANCED MAGNETRON SPUTTERING;
ANNEALING;
HARDNESS;
INORGANIC COATINGS;
METALLIC FILMS;
MICROSTRUCTURE;
SCANNING ELECTRON MICROSCOPY;
SEMICONDUCTING SILICON COMPOUNDS;
SILICON WAFERS;
SURFACE MORPHOLOGY;
SURFACE PROPERTIES;
SURFACE ROUGHNESS;
THIN FILMS;
TITANIUM NITRIDE;
VACUUM;
X RAY DIFFRACTION;
CRYSTAL STRUCTURE;
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EID: 77950857480
PISSN: 09258388
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jallcom.2010.02.176 Document Type: Article |
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Times cited : (48)
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References (18)
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