Electromigration in flip chip solder joints

AIP Conference Proceedings

Volumn 817, Issue , 2006, Pages 327-338

  Tu, K N ^a   Yan, M Y ^a   Ren, F ^a   Huang, J ^a   Ou, E ^a   Zhang, L Y ^a   Nah, J W ^a  

^a Engineering IV   (United States)

Author keywords

Electromigration; Flip chip; Solder; Vacancy flux; Voids

Indexed keywords

EID: 33751213580     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.2173566     Document Type: Conference Paper

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