A comparison study of electromigration performance of Pb-free flip chip solder bumps

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 903-908

  Su, Peng ^a   Li, Li ^a   Lai, Yi Shao ^b   Chiu, Ying Ta ^b   Kao, Chin Li ^b  

^a CISCO SYSTEMS   (United States)

^b Advanced Semiconductor Engineering Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BLACK'S EQUATION; COMPARISON STUDY; DESIGN STRATEGIES; DIE SURFACE; DRIVING FORCES; ELECTRONIC SYSTEMS; FLIP CHIP SOLDER BUMP; FLIP CHIP SOLDER JOINTS; INTEGRATED CIRCUIT COMPONENTS; LIFETIME DATA; OPENING SIZES; OPERATION TEMPERATURE; PB-FREE; PB-FREE SOLDER BUMP; POWER LEVELS; PREDICTION MODEL; SNPB SOLDER BUMP; SOLDER BUMP; TECHNOLOGY NODES; TEST VEHICLE; UNDER BUMP METALLIZATION;

AUTOMOBILE ELECTRONIC EQUIPMENT; AUTOMOBILE PARTS AND EQUIPMENT; DISSOLUTION; ELECTROMIGRATION; EUTECTICS; FLIP CHIP DEVICES; INTEGRATED CIRCUITS; LEAD; MATHEMATICAL MODELS; METALLIZING; SILVER; SOLDERED JOINTS;

SOLDERING ALLOYS;

EID: 70349668483     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074120     Document Type: Conference Paper

References (6)

1. Ding, M, et al, " Electromigration Study of High Lead Solders in Flip-Chip Packages using the Wheatstone Bridge Method, " Proceedings - Electronic Components and Technology Conference, 2004, p 968-973.
2. Su, P, et al, " An Evaluation of Electromigration Performance of SnPb and Pb-free Flip Chip Solder Joints", Proceedings of Electronic Components and Technology Conference, 2005.
3. Lai, Y., et al, " Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages", Microelectronics Reliability, Vol. 46, No. 8, pp. 1357- 1368, 2006. (Pubitemid 44150551)
4. Lai, Y., " Calibration of electromigration reliability of flipchip packages by electrothermal coupling analysis", Journal of Electronic Materials, Vol. 35, No. 5, pp. 972- 977, 2006. (Pubitemid 43875261)
5. Lai Y., et al, " Characteristics of current crowding in flipchip solder bumps", Microelectronics Reliability, Vol. 46, No. 5-6, pp. 915-922, 2006.
6. Lai Y., et al, " Electromigration reliability and morphologies of Cu pillar flip-chip solder joints with Cu substrate pad metallization", Journal of Electronic Materials, Vol. 37, No. 10, pp. 1624-1630, 2008.