SCOPUS 정보 검색 플랫폼

Volumn 38, Issue 12, 2009, Pages 2443-2448

Nonuniform and negative marker displacements induced by current crowding during electromigration in flip-chip Sn-0.7Cu solder joints

(6) Liang, S W a Hsiao, Hsiang Yao a Chen, Chih a Xu, Luhua b Tu, K N b Lai, Yi Shao c

a NATIONAL CHIAO TUNG UNIVERSITY (Taiwan)

b UNIVERSITY OF CALIFORNIA (United States)

c ADVANCED SEMICONDUCTOR ENGINEERING INC (Taiwan)

Author keywords

Electromigration; Pb free solder

Indexed keywords

BACKFLOW; CURRENT CROWDING; ELECTRON FLOW; FLIP CHIP; NON-UNIFORM DISTRIBUTION; NONUNIFORM; PB FREE SOLDERS; PB-FREE SOLDER; POLISHED SURFACES; QUANTITATIVE ANALYSIS; SN-0.7CU SOLDER; SOLDER JOINTS; STRESS-INDUCED; VOLUME MODELS;

ELECTROMIGRATION; FLIP CHIP DEVICES; LEAD; SOLDERING ALLOYS;

TIN;

EID: 72549113772 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0913-1 Document Type: Article

Times cited : (5)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.