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Volumn 518, Issue 24, 2010, Pages 7483-7486
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Cathodic arc plasma deposited TiAlSiN thin films using an Al-15 at.% Si cathode
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Author keywords
Cathodic arc plasma deposition; Multilayered structures; TiAlSiN thin films
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Indexed keywords
ARC CURRENT;
CATHODIC ARC PLASMA;
CATHODIC ARC PLASMA DEPOSITION;
CATHODIC ARC PLASMA DEPOSITION SYSTEM;
MAXIMUM HARDNESS;
MULTI-LAYERED STRUCTURE;
NANOCRYSTALLINES;
STEEL SUBSTRATE;
SUBSTRATE BIAS VOLTAGES;
TIALSIN;
TIN LAYERS;
ALUMINUM;
BIAS VOLTAGE;
DEPOSITION;
ELECTRIC ARCS;
HARDNESS;
MECHANICAL PROPERTIES;
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;
PLASMAS;
SEMICONDUCTING SILICON COMPOUNDS;
SUBSTRATES;
THIN FILMS;
TITANIUM NITRIDE;
TOOL STEEL;
VAPOR DEPOSITION;
PLASMA DEPOSITION;
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EID: 77956881086
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/j.tsf.2010.05.029 Document Type: Conference Paper |
Times cited : (30)
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References (23)
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