Solution reactions of a Bis(pyrrolylaldiminate)copper(II) complex with peralkyl zinc, aluminum, and boron reagents: Investigation of the pathways responsible for copper metal deposition

Chemistry of Materials

Volumn 22, Issue 17, 2010, Pages 4854-4866

  Vidjayacoumar, Balamurugan ^a   Emslie, David J H ^a   Blackwell, James M ^b   Clendenning, Scott B ^b   Britten, James F ^a  

^a MCMASTER UNIVERSITY   (Canada)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALKYL COMPLEXES; BOND FORMING; BORON REAGENTS; COPPER (II); COPPER COMPLEXES; COPPER DEPOSITION; COPPER METAL; ELEVATED TEMPERATURE; HYDRIDE ELIMINATION; LIGAND REDISTRIBUTION; PURE COMPOUNDS; REACTION BYPRODUCTS; REDUCTIVE ELIMINATION; ROOM TEMPERATURE; SOLUTION REACTION; THERMALLY STABLE; TWO STAGE;

ALUMINUM COATINGS; BORON; BORON COMPOUNDS; BYPRODUCTS; COPPER COMPOUNDS; ETHANE; ETHYLENE; REACTION KINETICS; ZINC;

COPPER;

EID: 77956404703     PISSN: 08974756     EISSN: 15205002     Source Type: Journal    
DOI: 10.1021/cm101443x     Document Type: Article

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