-
1
-
-
0000274548
-
-
APPLAB 0003-6951,. 10.1063/1.120816
-
W. S. Wong, T. Sands, and N. W. Cheung, Appl. Phys. Lett. APPLAB 0003-6951, 72, 599 (1998). 10.1063/1.120816
-
(1998)
Appl. Phys. Lett.
, vol.72
, pp. 599
-
-
Wong, W.S.1
Sands, T.2
Cheung, N.W.3
-
2
-
-
34548486661
-
-
ESLEF6 1099-0062,. 10.1149/1.2776904
-
S. Kim, D. -K. Bae, J. -H. Choi, J. -H. Jang, and J. -S. Lee, Electrochem. Solid-State Lett. ESLEF6 1099-0062, 10, H334 (2007). 10.1149/1.2776904
-
(2007)
Electrochem. Solid-State Lett.
, vol.10
, pp. 334
-
-
Kim, S.1
Bae, D.-K.2
Choi, J.-H.3
Jang, J.-H.4
Lee, J.-S.5
-
3
-
-
70350047077
-
-
ESLEF6 1099-0062,. 10.1149/1.3238468
-
S. Kim, Electrochem. Solid-State Lett. ESLEF6 1099-0062, 12, H441 (2009). 10.1149/1.3238468
-
(2009)
Electrochem. Solid-State Lett.
, vol.12
, pp. 441
-
-
Kim, S.1
-
4
-
-
21044447238
-
-
MCTCEF 0946-7076,. 10.1007/s00542-004-0442-z
-
R. L. Barber, M. K. Ghantasala, R. Divan, K. D. Vora, E. C. Harvey, and D. C. Mancini, Microsyst. Technol. MCTCEF 0946-7076, 11, 303 (2005). 10.1007/s00542-004-0442-z
-
(2005)
Microsyst. Technol.
, vol.11
, pp. 303
-
-
Barber, R.L.1
Ghantasala, M.K.2
Divan, R.3
Vora, K.D.4
Harvey, E.C.5
Mancini, D.C.6
-
5
-
-
0035125116
-
-
JMMIEZ 0960-1317,. 10.1088/0960-1317/11/1/304
-
J. Zhang, K. L. Tan, G. D. Hong, L. J. Yang, and H. Q. Gong, J. Micromech. Microeng. JMMIEZ 0960-1317, 11, 20 (2001). 10.1088/0960-1317/11/1/304
-
(2001)
J. Micromech. Microeng.
, vol.11
, pp. 20
-
-
Zhang, J.1
Tan, K.L.2
Hong, G.D.3
Yang, L.J.4
Gong, H.Q.5
-
6
-
-
49949099241
-
-
MCTCEF 0946-7076,. 10.1007/s00542-007-0534-7
-
J. Hammacher, A. Fuelle, J. Flaemig, J. Saupe, B. Loechel, and J. Grimm, Microsyst. Technol. MCTCEF 0946-7076, 14, 1515 (2008). 10.1007/s00542-007-0534-7
-
(2008)
Microsyst. Technol.
, vol.14
, pp. 1515
-
-
Hammacher, J.1
Fuelle, A.2
Flaemig, J.3
Saupe, J.4
Loechel, B.5
Grimm, J.6
-
7
-
-
0031685672
-
-
MIENEF 0167-9317,. 10.1016/S0167-9317(98)00086-0
-
H. Lorenz, M. Laudon, and P. Renaud, Microelectron. Eng. MIENEF 0167-9317, 41-42, 371 (1998). 10.1016/S0167-9317(98)00086-0
-
(1998)
Microelectron. Eng.
, vol.4142
, pp. 371
-
-
Lorenz, H.1
Laudon, M.2
Renaud, P.3
-
8
-
-
0037231215
-
-
JMMIEZ 0960-1317,. 10.1088/0960-1317/13/1/312
-
R. Feng and R. J. Farris, J. Micromech. Microeng. JMMIEZ 0960-1317, 13, 80 (2003). 10.1088/0960-1317/13/1/312
-
(2003)
J. Micromech. Microeng.
, vol.13
, pp. 80
-
-
Feng, R.1
Farris, R.J.2
-
9
-
-
44149103171
-
-
MIENEF 0167-9317,. 10.1016/j.mee.2008.01.033
-
A. T. Al-Halhouli, I. Kampen, T. Krah, and S. Büttgenbach, Microelectron. Eng. MIENEF 0167-9317, 85, 942 (2008). 10.1016/j.mee.2008.01.033
-
(2008)
Microelectron. Eng.
, vol.85
, pp. 942
-
-
Al-Halhouli, A.T.1
Kampen, I.2
Krah, T.3
Büttgenbach, S.4
-
10
-
-
0033356304
-
-
MRSPDH 0272-9172.
-
A. McAleavey, G. Coles, R. L. Edwards, and W. N. Sharpe, Mater. Res. Soc. Symp. Proc. MRSPDH 0272-9172, 546, 213 (1999).
-
(1999)
Mater. Res. Soc. Symp. Proc.
, vol.546
, pp. 213
-
-
McAleavey, A.1
Coles, G.2
Edwards, R.L.3
Sharpe, W.N.4
-
11
-
-
0242637018
-
-
JMMIEZ 0960-1317,. 10.1088/0960-1317/13/6/305
-
H. S. Khoo, K. -K. Liu, and F. -G. Tseng, J. Micromech. Microeng. JMMIEZ 0960-1317, 13, 822 (2003). 10.1088/0960-1317/13/6/305
-
(2003)
J. Micromech. Microeng.
, vol.13
, pp. 822
-
-
Khoo, H.S.1
Liu, K.-K.2
Tseng, F.-G.3
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