Mechanical characterization of a new high-aspect-ratio near UV-photoresist

Microelectronic Engineering

Volumn 41-42, Issue , 1998, Pages 371-374

  Lorenz, H ^a   Laudon, M ^a   Renaud, P ^a  

^a EPFL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

MECHANICAL PROPERTIES; PERFORMANCE; THERMODYNAMIC PROPERTIES; ULTRAVIOLET RADIATION;

HIGH-ASPECT-RATIO;

PHOTORESISTS;

EID: 0031685672     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(98)00086-0     Document Type: Article

References (7)

1. H. Lorenz, et al., "SU-8 : A Low-cost Negative Resist for MEMS", J. Micromech. Microeng. 7, (1997) pp. 121-124.
2. M. Despont et al., "High-Aspect-Ratio, Ultrathick, Negative-Tone Near-UV Photoresist for MEMS Applications" Proc. of the 10th MEMS Workshop, Nagoya, Japan, Jan., (1997), pp. 518-522.
3. H. Lorenz et al., "Fabrication of Micromechanical Components and Micromolds Using a New Photoplastic UV Resist" Proc. of HARMST 97, Madison, WI, (1997), pp. 27-28.
4. R. Glang, et al., "Determination of Stress in Films on Single Crystalline Silicon Structures" Review of Scientific Instruments, Vol., 36, No. 1, pp. 7-10, 1965.
5. R. Roark, W. Young, Roak's Formulas for Stress and Strain, McGraw-Hill, 6th ed., 1989.
6. R. Cook, W. Young, Advanced Mechanics of Materials, Macmillan Publishing, NY, 1985.
7. D. Doane, et al., Multichip Module Technologies and Alternatives, Van Nostrand, NY.