Stress engineering and mechanical properties of SU-8-layers for mechanical applications

Microsystem Technologies

Volumn 14, Issue 9-11, 2008, Pages 1515-1523

  Hammacher, J ^a   Fuelle, A ^a   Flaemig, J ^a   Saupe, J ^a   Loechel, B ^b   Grimm, J ^a  

^a UNIVERSITY OF APPLIED SCIENCES   (Germany)

^b HAHN MEITNER INSTITUT   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRONIC EQUIPMENT TESTING; LASER INTERFEROMETRY; MECHANICAL PROPERTIES; TECHNOLOGY;

CHIP CARRIERS; EXPOSURE CONDITIONS; IN-SITU MONITORING; MICRO-HARDNESS; MICRO-MECHANICAL; MICRO-SYSTEM TECHNOLOGIES; POST EXPOSURE BAKING; REPRODUCIBLE PRODUCTION; SCANNING CALORIMETRY; SOFT BAKE; SOLID CONTENTS; STRESS BEHAVIOUR; STRESS ENGINEERING; YOUNG'S MODULUS;

STRESSES;

EID: 49949099241     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-007-0534-7     Document Type: Conference Paper

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