Bottom-up filling in electroless plating with an addition of PEG-PPG triblock copolymers

Electrochemical and Solid-State Letters

Volumn 13, Issue 7, 2010, Pages

  Yang, Zhifeng ^a   Li, Na ^a   Wang, Xu ^a   Wang, Zhixiang ^a   Wang, Zenglin ^a  

^a SHAANXI NORMAL UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ANODIC REACTIONS; BOTTOM-UP FILLING; BOTTOM-UP FILLING BEHAVIOR; CROSS-SECTIONAL SCANNING ELECTRON MICROSCOPIES; ELECTROLESS COPPER; ELECTROLESS DEPOSITION; ETHYLENE OXIDES; PLATING BATH; PROPYLENE GLYCOLS; SUBMICROMETER TRENCHES; TRIBLOCK COPOLYMERS;

BLOCK COPOLYMERS; COPOLYMERIZATION; COPPER; ELECTROLESS PLATING; ELECTROPLATING; ETHYLENE; ETHYLENE GLYCOL; FILLING; PHOTOLITHOGRAPHY; POLYETHYLENE OXIDES; POLYPROPYLENE OXIDES; PROPYLENE; SCANNING ELECTRON MICROSCOPY;

POLYETHYLENE GLYCOLS;

EID: 77956198905     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3388488     Document Type: Article

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