Effect of the purity of plating materials on the reduction of resistivity of Cu wires for future LSIs

Journal of the Electrochemical Society

Volumn 157, Issue 9, 2010, Pages

  Onuki, Jin ^a   Tashiro, Suguru ^a   Khoo, Khyoupin ^a   Ishikawa, Nobuhiro ^b   Kimura, Takashi ^b   Chonan, Yasunori ^c   Akahoshi, Haruo ^d  

^a IBARAKI UNIVERSITY   (Japan)

^b NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

^c AKITA PREFECTURAL UNIVERSITY   (Japan)

^d HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CU WIRES; GRAIN SIZE; HIGH PURITY; IMPURITY CONCENTRATION; IN-LINE; PLATING MATERIALS; PLATING PROCESS;

PLATING;

WIRE;

EID: 77955821710     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3458871     Document Type: Article

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