Texture investigation in the trench depth direction of very fine copper wires less than 100 nm wide using electron backscatter diffraction

Thin Solid Films

Volumn 518, Issue 12, 2010, Pages 3413-3416

  Khoo, Khyoupin ^a   Onuki, Jin ^a  

^a IBARAKI UNIVERSITY   (Japan)

Author keywords

Chemical mechanical polishing; Coincidence lattice site boundary; Cu wire; Electron backscatter diffraction; Grain size; Resistivity; Texture

Indexed keywords

COINCIDENCE LATTICE SITE BOUNDARY; COINCIDENCE LATTICES; ELECTRON BACK SCATTER DIFFRACTION; GRAIN SIZE; RESISTIVITY;

BACKSCATTERING; CHEMICAL MECHANICAL POLISHING; ELECTRON DIFFRACTION; GRAIN SIZE AND SHAPE; POLISHING; TEXTURES; WIRE;

CHEMICAL POLISHING;

EID: 77649217981     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.11.022     Document Type: Article

References (9)

1. Hinode K., Hanaoka Y., Takeda K., and Kondo S. Jpn. J. Appl. Phys. 40 (2001) L1097
2. Steinhögl W., Schindler G., Steinlesberger G., and Engelhardt M. Phys. Rev. B 66 (2002) 075414
3. Wu W., Brongersma S.H., Van Hove M., and Maex K. Appl. Phys. Lett. 84 (2004) 2838
4. The International Technology Roadmap for Semiconductors (ITRS). 2006 edition (2006)
5. Wu W., Ermur D., Brongersma S.H., Van Hove M., and Maex K. Microelectron. Eng. 76 (2004) 190
6. Khoo K.P., Onuki J., Nagano T., Chonan Y., Akahoshi H., Tobita T., Chiba M., Saito T., and Ishikawa K. Jpn. J. Appl. Phys. 45 (2006) L852
7. Khoo K., Onuki J., Nagano T., Chonan Y., Akahoshi H., Tobita T., Chiba M., Saito T., and Ishikawa K. Advanced Metallization Conference, Tokyo, Japan, September 26-27, 2006, Materials Research Society Symposium Proceedings (2006) 58
8. Vaidya S., and Sinha A.K. Thin Solid Films 75 (1981) 253
9. Lingk C., and Gross M.E. J. Appl. Phys. 84 (1998) 5547