Recent applications of optical and computer-vision methods to research for microelectronics assembly reliability

Optics and Lasers in Engineering

Volumn 48, Issue 11, 2010, Pages 1046-1057

  Lu, Hua ^a   Sun, Cuiru ^a   Zhou, Ming ^a   Shirazi, Alireza ^a  

^a RYERSON UNIVERSITY   (Canada)

Author keywords

3D in situ deformation measurement; Digital Speckle Correlation; Failure physics based evaluation; Fiber Bragg grating strain sensor; Micro and sub micro resolution; Microelectronics assembly reliability; Projected Speckle Digital Correlation

Indexed keywords

DIGITAL CORRELATION; DIGITAL SPECKLE CORRELATION; FAILURE PHYSICS; FAILURE PHYSICS-BASED EVALUATION; IN-SITU; MICROELECTRONICS ASSEMBLY; MICROELECTRONICS ASSEMBLY RELIABILITY; PROJECTED SPECKLE DIGITAL CORRELATION; STRAIN SENSORS;

DEFORMATION; FIBER BRAGG GRATINGS; FIBER OPTIC COMPONENTS; FIBER OPTIC SENSORS; RELIABILITY; RESEARCH; SENSORS; SPECKLE; THREE DIMENSIONAL;

MICROELECTRONICS;

EID: 77955558583     PISSN: 01438166     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.optlaseng.2009.12.004     Document Type: Article

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