Thermally induced deformation of solder joints in real packages: Measurement and analysis

Microelectronics Reliability

Volumn 46, Issue 7, 2006, Pages 1148-1159

  Lu, Hua ^a   Shi, Helen ^a   Zhou, Ming ^a  

^a RYERSON UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; DEFORMATION; ELECTRONICS PACKAGING; HYSTERESIS; SHEAR STRESS; STRAIN; STRESS RELAXATION; THERMAL EFFECTS;

CREEP STRAIN; RESISTOR PACKAGE; STRESS-STRAIN HYSTERESIS; THERMALLY INDUCED DEFORMATION;

SOLDERED JOINTS;

EID: 33646381899     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.10.002     Document Type: Article

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