Optimizing the precision of the four-point bend test for the measurement of thin film adhesion

Microelectronic Engineering

Volumn 82, Issue 2, 2005, Pages 99-112

  Shaviv, R ^a   Roham, S ^a   Woytowitz, P ^a  

^a NOVELLUS SYSTEMS INC   (United States)

Author keywords

Fracture and fracture toughness; Interface adhesion; Low k dielectric; Thin films

Indexed keywords

ADHESION; DIELECTRIC MATERIALS; FINITE ELEMENT METHOD; FRACTURE; FRACTURE TOUGHNESS; MEASUREMENTS; OPTIMIZATION;

EDGE POLISHING; INTERFACE ADHESION; LOW-K DIELECTRIC; NOTCH DEPTH;

THIN FILMS;

EID: 25444447431     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2005.06.006     Document Type: Article

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