SCOPUS 정보 검색 플랫폼

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 1, 2006, Pages 5-12

Electronic packaging solder joint reliablity assessment with a mechanics-based strain gage methodology

(3) Mercado, Lei L a Hsieh, George b Girouard, Steven b

Author keywords

Bend mode; Electronic components; Field use conditions; Finite element simulation; Original equipment manufacturer (OEM) assembly; Solder joint failure; Strain gages; Strain matching criterion

Indexed keywords

BENDING (DEFORMATION); COMPUTER SIMULATION; FAILURE ANALYSIS; FINITE ELEMENT METHOD; PRINTED CIRCUIT BOARDS; RELIABILITY; SEMICONDUCTOR DEVICE MANUFACTURE; SOLDERED JOINTS; STRAIN GAGES; STRESS CONCENTRATION;

ELECTRONIC COMPONENT; FIELD USE CONDITIONS; ORIGINAL EQUIPMENT MANUFACTURERS ASSEMBLY; STRAIN MATCHING CRITERION;

ELECTRONICS PACKAGING;

EID: 33644790234 PISSN: 15213331 EISSN: None Source Type: Journal
DOI: 10.1109/TCAPT.2005.848583 Document Type: Article

Times cited : (14)

References (7)

1
- 0038688691
- "Analysis of solder joint fracture under mechanical bending test"
- May 27-30
- K. Harada, S. Baba, Q. Wu, H. Matsushima, T. Matsunaga, Y. Ucgai, and M. Kimura, "Analysis of solder joint fracture under mechanical bending test," in Proc. 53rd Electronic Components Technology Conf., May 27-30, 2003, pp. 1731-1737.
- (2003) Proc. 53rd Electronic Components Technology Conf. , pp. 1731-1737
- Harada, K.¹ Baba, S.² Wu, Q.³ Matsushima, H.⁴ Matsunaga, T.⁵ Ucgai, Y.⁶ Kimura, M.⁷

2
- 0742286699
- "A study on the variation of effective CTE of printed circuit boards through a validated comparison between strain gages and Moiré interferometry"
- Dec
- T. B. Ratanawilai, B. Hunter, G. Subbarayan, and D. Rose, "A study on the variation of effective CTE of printed circuit boards through a validated comparison between strain gages and Moiré interferometry," IEEE Trans. Compon. Packag. Technol., vol. 26, no. 4, pp. 712-718, Dec. 2003.
- (2003) IEEE Trans. Compon. Packag. Technol. , vol.26 , Issue.4 , pp. 712-718
- Ratanawilai, T.B.¹ Hunter, B.² Subbarayan, G.³ Rose, D.⁴

3
- 10444245851
- "Use-condition-based cyclic bend test development for handheld components"
- Las Vegas, NV, Jun. 2-4
- L. L. Mercado, B. Phillips, S. Sahasrabudhe, J. P. Sedillo, D. Bray, E. Monroe, K. J. Lee, and G. Lo, "Use-condition-based cyclic bend test development for handheld components," in Proc. 53rd Electronic Components Technology Conf., Las Vegas, NV, Jun. 2-4, 2004, pp. 1279-1287.
- (2004) Proc. 53rd Electronic Components Technology Conf. , pp. 1279-1287
- Mercado, L.L.¹ Phillips, B.² Sahasrabudhe, S.³ Sedillo, J.P.⁴ Bray, D.⁵ Monroe, E.⁶ Lee, K.J.⁷ Lo, G.⁸

4
- 24644495855
- Joint Std. IPC/JEDEC-9702
- Monotonic Bend Characterization of Board-Level Interconnects, Joint Std. IPC/JEDEC-9702, 2004.
- (2004) Monotonic Bend Characterization of Board-Level Interconnects

5
- 33644790263
- Std. Pending
- JEDEC Cyclic Bend Test Standard, Std. Pending, 2005.
- (2005) JEDEC Cyclic Bend Test Standard

6
- 33644795627
- Sun Microsystems
- Tech. Rep
- Sun Microsystems, "Strain Gage Test Procedure," Tech. Rep., 2004.
- (2004) "Strain Gage Test Procedure"

7
- 33644795784
- "ANSYS Software"
- ANSYS Inc
- "ANSYS Software," ANSYS, Inc., 2005.
- (2005)

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.