Design and validation of a novel master-making process chain for organic and large area electronics on flexible substrates

Microelectronic Engineering

Volumn 87, Issue 11, 2010, Pages 2139-2145

  Velkova, V ^a   Lalev, G ^a   Hirshy, H ^a   Scholz, S ^a   Hiitola Keinanen J ^b   Gold, H ^c   Haase, A ^c   Hast, J ^b   Stadlober, B ^c   Dimov, S ^a  

^a CARDIFF UNIVERSITY   (United Kingdom)

^b VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

^c Joanneum Research   (Australia)

Author keywords

Electroforming; FIB; Organic electronics; OTFT; Process chain; R2R; Tool manufacture; UV NIL

Indexed keywords

COMPONENT TECHNOLOGIES; DIFFERENT LENGTH SCALE; FLEXIBLE SUBSTRATE; LARGE-AREA ELECTRONICS; MAKING PROCESS; MICRO STRUCTURING; MICROPATTERNED; NANOPATTERNING; NOVEL PROCESS; ONE STEP; ORGANIC ELECTRONIC DEVICES; ORGANIC ELECTRONICS; OTFT; PROCESS CHAIN; REPLICATION MASTER; SUBMICRON; UV NANOIMPRINT LITHOGRAPHY;

ELECTROCHEMISTRY; ELECTROFORMING; ELECTROMETALLURGY; FLEXIBLE ELECTRONICS; FUSED SILICA; NANOIMPRINT LITHOGRAPHY; PHOTOLITHOGRAPHY; SILICA; SUBSTRATES;

FABRICATION;

EID: 77955518121     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2010.01.015     Document Type: Article

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