FIB sputtering optimization using Ion Reverse Software

Microelectronic Engineering

Volumn 86, Issue 4-6, 2009, Pages 544-547

  Svintsov, A ^a   Zaitsev, S ^a   Lalev, G ^b   Dimov, S ^b   Velkova, V ^b   Hirshy, H ^b  

^a INSTITUTE OF MICROELECTRONICS TECHNOLOGY AND HIGH PURITY MATERIALS   (Russian Federation)

^b CARDIFF UNIVERSITY   (United Kingdom)

Author keywords

3D ion patterning; Etching simulation; FIB; Software

Indexed keywords

3D ION PATTERNING; 3D PROFILES; DATA PREPARATIONS; FIB; FOCUSED ION BEAM MILLINGS; OPERATING MODES; RE DEPOSITIONS; SOFTWARE;

ANISOTROPIC ETCHING; EMBEDDED SOFTWARE; IONS; THREE DIMENSIONAL;

FOCUSED ION BEAMS;

EID: 65549160831     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2009.01.073     Document Type: Article

References (8)

1. Lalev G., Dimov S., Kettle J., Van Delft F., and Minev R. Journal of Engineering Manufacture 222 (2008) 67-76
2. Zaitsev S.I., and Svintsov A.A. Poverkhn 7 (1986) 27
3. Zaitsev S.I., and Svintsov A.A. Poverkhn 1 (1987) 47
4. http://www.charpan.com/project_tool3.html.
5. Andersen H.H., and Bay H.L. Sputtering by Particle Bombardment I. In: Berish R. (Ed) (1981), Springer-Verlag
6. Aristov V.V., Gaifullin B.N., Svintsov A.A., Zaitsev S.I., Jede R.R., and Raith H.F. Accuracy of proximity correction in electron lithography after development. The Journal of Vacuum Science and Technology B 10 6 (1992) 2459-2467
7. J.F. Ziegler, J.P. Biersack, SRIM (2003) (Program and Documentation). http://www.srim.org.
8. Platzgummer E., Biedermann A., Langfischer H., Eder-Kapl S., Kuemmel M., Cernusca S., Loeschner H., Lehrer C., Frey L., Lugstein A., and Bertagnolli E. Microelectronic Engineering 83 4-9 (2006) 936-939