-
2
-
-
0035900398
-
-
S. A. Wolf, D. D. Awschalom, R. A. Buhrman, J. M. Daughton, S. Von Molnar, M. L. Roukes, A. Y. Chtchelkanova, and D. M. Treger, Science 294, 1488 (2001).
-
(2001)
Science
, vol.294
, pp. 1488
-
-
Wolf, S.A.1
Awschalom, D.D.2
Buhrman, R.A.3
Daughton, J.M.4
Von Molnar, S.5
Roukes, M.L.6
Chtchelkanova, A.Y.7
Treger, D.M.8
-
6
-
-
34248653757
-
-
A. Bindal, A. Naresh, P. Yuan, K. K. Nguyen, and S. Hamedi-Hagh, IEEE Trans. Nanotechnology 6, 291 (2007).
-
(2007)
IEEE Trans. Nanotechnology
, vol.6
, pp. 291
-
-
Bindal, A.1
Naresh, A.2
Yuan, P.3
Nguyen, K.K.4
Hamedi-Hagh, S.5
-
7
-
-
21644447902
-
Advanced CMOS transistors in nanotechnology era for high-performance, low power logic applications
-
R. Chau, M. Doczy, B. Doyle, S. Datta, G. Dewey, J. Kavalieros, B. Jin, M. Metz, A. Majumdar, and M. Radosavljevic, Advanced CMOS transistors in nanotechnology era for high-performance, low power logic applications, 7th Int. Conf. Sol. State Integr. Cir. Tech. (2004), Vol. 1, pp. 18-21.
-
(2004)
7th Int. Conf. Sol. State Integr. Cir. Tech.
, vol.1
, pp. 18-21
-
-
Chau, R.1
Doczy, M.2
Doyle, B.3
Datta, S.4
Dewey, G.5
Kavalieros, J.6
Jin, B.7
Metz, M.8
Majumdar, A.9
Radosavljevic, M.10
-
8
-
-
34548535501
-
FinFET: The prospective multi-gate device for future SOC applications
-
S. Inaba, K. Okano, T. Izumida, A. Kaneko, H. Kawasaki, A. Yagishita, T. Kanemura, T. Ishida, N. Aoki, K. Ishimaru, K. Suguro, K. Eguchi, Y Tsunashima, Y Toyoshima, and T. Ishida, FinFET: the prospective multi-gate device for future SOC applications. Proc. 36th Euro. Sol. State Dev. Res. Conf. (2006), pp. 49-52.
-
(2006)
Proc. 36th Euro. Sol. State Dev. Res. Conf.
, pp. 49-52
-
-
Inaba, S.1
Okano, K.2
Izumida, T.3
Kaneko, A.4
Kawasaki, H.5
Yagishita, A.6
Kanemura, T.7
Ishida, T.8
Aoki, N.9
Ishimaru, K.10
Suguro, K.11
Eguchi, K.12
Tsunashima, Y.13
Toyoshima, Y.14
Ishida, T.15
-
9
-
-
33846284604
-
-
H. Wakabayashi, T. Ezaki, T. Sakamoto, H. Kawaura, N. Ikarashi, N. Ikezawa, M. Narihiro, Y. Ochiai, T. Ikezawa, K. Takeuchi, T. Yamamoto, M. Hane, and T. Mogami, IEEE Trans. Elec. Dev. 53, 1961 (2006).
-
(2006)
IEEE Trans. Elec. Dev.
, vol.53
, pp. 1961
-
-
Wakabayashi, H.1
Ezaki, T.2
Sakamoto, T.3
Kawaura, H.4
Ikarashi, N.5
Ikezawa, N.6
Narihiro, M.7
Ochiai, Y.8
Ikezawa, T.9
Takeuchi, K.10
Yamamoto, T.11
Hane, M.12
Mogami, T.13
-
13
-
-
77952700887
-
-
A. Bindal, T. Ogura, N. Ogura, and S. Hamedi-Hagh, J. Nanoelectron. Optoelectron. 4, 342 (2009).
-
(2009)
J. Nanoelectron. Optoelectron.
, vol.4
, pp. 342
-
-
Bindal, A.1
Ogura, T.2
Ogura, N.3
Hamedi-Hagh, S.4
-
16
-
-
17444434220
-
-
M. Kawamura, T. Mashima, Y Abe, and K. Sasaki, Thin Solid Films 377-378, 537 (2000).
-
(2000)
Thin Solid Films
, vol.377-378
, pp. 537
-
-
Kawamura, M.1
Mashima, T.2
Abe, Y.3
Sasaki, K.4
-
17
-
-
0035281728
-
-
H. D. Liu, Y. P. Zhao, G. Ramanath, S. P. Murarka, and G. C. Wang, Thin Solid Films 384, 151 (2001).
-
(2001)
Thin Solid Films
, vol.384
, pp. 151
-
-
Liu, H.D.1
Zhao, Y.P.2
Ramanath, G.3
Murarka, S.P.4
Wang, G.C.5
-
18
-
-
33644958333
-
A comparative scaling analysis of metallic and carbon nanotube interconnections for nanometer scale VLSI technologies
-
N. Srivastava and K. Banerjee, A comparative scaling analysis of metallic and carbon nanotube interconnections for nanometer scale VLSI technologies, Proc. 21st Conf. Int. VLSI Multilevel Interconn. Conf. (2004), pp. 393-398.
-
(2004)
Proc. 21st Conf. Int. VLSI Multilevel Interconn. Conf.
, pp. 393-398
-
-
Srivastava, N.1
Banerjee, K.2
-
19
-
-
0031257846
-
-
J. S. Wu, M. L. Liou, H. P. Ma, and T. D. Chiueh, IEEE Trans. Solid-State Ckts. 32, 1499 (1997).
-
(1997)
IEEE Trans. Solid-State Ckts.
, vol.32
, pp. 1499
-
-
Wu, J.S.1
Liou, M.L.2
Ma, H.P.3
Chiueh, T.D.4
-
20
-
-
0031642241
-
Implementation of a DSSS modem ASIC chip for wireless LAN
-
H. M. Chang, M. H. Sunwoo, Implementation of a DSSS modem ASIC chip for wireless LAN, IEEE Workshop Signal Proc. Sys. (1998), pp. 243-252.
-
(1998)
IEEE Workshop Signal Proc. Sys.
, pp. 243-252
-
-
Chang, H.M.1
Sunwoo, M.H.2
-
21
-
-
34250759774
-
A single-chip direct-sequence spreadspectrum CMOS transceiver for high performance, low cost 2.4-GHz cordless applications
-
Y. H. Lin, K. U. Chan, C. J. Chang, T. M. Chen, Y. Y. Lin, and H. C. Kang, A single-chip direct-sequence spreadspectrum CMOS transceiver for high performance, low cost 2.4-GHz cordless applications, Asian Solid State Ckt. Conf. (2005), pp. 253-256.
-
(2005)
Asian Solid State Ckt. Conf.
, pp. 253-256
-
-
Lin, Y.H.1
Chan, K.U.2
Chang, C.J.3
Chen, T.M.4
Lin, Y.Y.5
Kang, H.C.6
-
22
-
-
39749178602
-
A DSSS UWB digital PHY/MAC transceiver for wireless ad hoc mesh networks with distributed control
-
A. Koyama, H. Iwami, Y Mizoguchi, S. Tashiro, F. Nishiyama, T. Yamagata, Y Hashimoto, M. Takada, K. Watanabe, J. Iwasaki, and M. Suzuki, A DSSS UWB digital PHY/MAC transceiver for wireless ad hoc mesh networks with distributed control, IEEE Solid State Ckt. Conf. (2006), pp. 992-1001.
-
(2006)
IEEE Solid State Ckt. Conf.
, pp. 992-1001
-
-
Koyama, A.1
Iwami, H.2
Mizoguchi, Y.3
Tashiro, S.4
Nishiyama, F.5
Yamagata, T.6
Hashimoto, Y.7
Takada, M.8
Watanabe, K.9
Iwasaki, J.10
Suzuki, M.11
|