Implantable RF-coiled chip packaging

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2008, Pages 108-111

  Li, W ^a   Rodger, D C ^a,b   Tai, Y C ^a  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

^b UNIVERSITY OF SOUTHERN CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES;

CHIP INTEGRATION; CHIP PACKAGING; EMBEDDED CHIPS; INTEGRATION TECHNOLOGIES; PARYLENE C; PARYLENES; RADIO FREQUENCY IDENTIFICATION CHIPS; RADIO-FREQUENCY COIL; RADIOFREQUENCIES; TWO-LAYER;

RADIO FREQUENCY IDENTIFICATION (RFID);

EID: 50149085564     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2008.4443604     Document Type: Conference Paper

References (8)

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