Investigation of hierarchically branched-microchannel coolers fabricated by deep reactive ion etching for Electronics cooling applications

Journal of Heat Transfer

Volumn 131, Issue 5, 2009, Pages 1-9

  Calame, J P ^a   Park, D ^a   Bass, R ^a   Myers, R E ^b   Safier, P N ^c  

^a NAVAL RESEARCH LABORATORY   (United States)

^b NORTHROP GRUMMAN CORPORATION   (United States)

^c S and J Solutions LLC   (United States)

Author keywords

Constructal theory; Constructal trees; Electronic cooling; Forced convection; Fractal geometry; GaN; Microchannel cooler; SiC; Single phase

Indexed keywords

CONSTRUCTAL; CONSTRUCTAL THEORY; ELECTRONIC COOLING; FRACTAL GEOMETRY; MICROCHANNEL COOLERS; SINGLE PHASE;

ATMOSPHERIC TEMPERATURE; BODIES OF REVOLUTION; CERAMIC MATERIALS; COOLING; COOLING SYSTEMS; DIES; FORCED CONVECTION; FRACTALS; GALLIUM ALLOYS; GALLIUM NITRIDE; GRAPH THEORY; HEAT FLUX; MICROWAVE CIRCUITS; MICROWAVE DEVICES; MICROWAVE INTEGRATED CIRCUITS; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; REACTIVE ION ETCHING; SEMICONDUCTING SILICON COMPOUNDS; SILICON CARBIDE; SILICON WAFERS; SINGLE CRYSTALS; SURFACE PROPERTIES;

MICROCHANNELS;

EID: 77955235721     PISSN: 00221481     EISSN: 15288943     Source Type: Journal    
DOI: 10.1115/1.3001017     Document Type: Article

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